MAX9118EXK
Rev. B
RELIABILITY REPORT
FOR
MAX9118EXK
PLASTIC ENCAPSULATED DEVICES
April 6, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX9118 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX9118 nanopower comparator a in space-saving SC70 packages feature Beyond-the-Rails™ inputs and are
is guaranteed to operate down to +1.8V. The MAX9118 features an on-board 1.252V ±1.75% reference and draw an
ultra-low supply current of only 600nA. This feature makes the MAX9118 comparator ideal for all 2-cell battery
monitoring/management applications.
The unique design of the output stage limits supply-current surges while switching, virtually eliminating the supply
glitches typical of many other comparators. This design also minimizes overall power consumption under dynamic
conditions. The MAX9118 has an open-drain output stage that makes them suitable for mixed-voltage system
design. Large internal output drivers allow Rail-to-Rail® output swing with loads up to 5mA. The device is available in
the ultra-small 5-pin SC70 package.
B. Absolute Maximum Ratings
Item
Supply Voltage (VCC to VEE)
Voltage Inputs (IN+, IN-, REF)
Output Voltage
Current Into Input Pins
Output Current
Output Short-Circuit Duration
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
5-Pin SC70
Derates above +70°C
5-Pin SC70
Rating
+6V
(VEE - 0.3V) to (VCC + 0.3V)
(VEE - 0.3V) to (VCC + 0.3V)
20mA
±50mA
10s
-40°C to +85°C
+150°C
-65°C to +150°C
+300°C
200mW
2.5mW/°C
II. Manufacturing Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
SC70, 1.8V, Nanopower, Beyond-the-Rails Comparators With Reference
B8 (Standard 0.8 micron silicon gate CMOS)
98
California, USA
Malaysia or Philippines
January, 2001
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
5-Pin SC70
Alloy 42 or Copper
Solder Plate
Silver-Filled Epoxy
Gold (1.0 mil dia.)
Epoxy with silica filler
# 05-1501-0220
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-020-A:
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
31 x 30 mils
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
0.8 microns (as drawn)
0.8 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in
Table 1.
Using these results, the Failure
Rate (λ) is calculated as follows:
λ
=
1
=
MTTF
1.83
192 x 4389 x 80 x 2
(Chi square value for MTTF upper limit)
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 13.57 x 10
-9
λ
= 13.57 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5415) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The CM82-1 die type has been found to have all pins able to withstand a transient pulse of
±2000V,
per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±250mA.
Table 1
Reliability Evaluation Test Results
MAX9118EXK
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
PACKAGE
Static Life Test
(Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing
(Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
80
0
DC Parameters
& functionality
SC70
77
0
85/85
DC Parameters
& functionality
77
0
Mechanical Stress
(Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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