SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20
串行输入负载, 3 us 稳定 时间, 12位 数模转换器, PDSO20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC20,.20SQ,25 |
针数 | 20 |
Reach Compliance Code | _compli |
最大模拟输出电压 | 5.25 V |
最小模拟输出电压 | |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | SERIAL |
JESD-30 代码 | S-XQCC-N20 |
JESD-609代码 | e0 |
长度 | 5 mm |
最大线性误差 (EL) | 0.0977% |
湿度敏感等级 | 1 |
位数 | 10 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC20,.20SQ,25 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 |
电源 | 2/5,3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大稳定时间 | 6 µs |
标称安定时间 (tstl) | 2.5 µs |
最大压摆率 | 4 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 5 mm |
MAX5583ETP | MAX5580_07 | MAX5585ETP | MAX5582ETP | MAX5584ETP | MAX5581BETP | MAX5581AETP | |
---|---|---|---|---|---|---|---|
描述 | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20 | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20 | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20 | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20 | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20 | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20 | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PDSO20 |
最大模拟输出电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
输入格式 | SERIAL | 串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
表面贴装 | YES | Yes | YES | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | QUAD | 双 | QUAD | QUAD | QUAD | QUAD | QUAD |
是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | QFN | - | QFN | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, LCC20,.20SQ,25 | - | HVQCCN, LCC20,.20SQ,25 | HVQCCN, LCC20,.20SQ,25 | HVQCCN, LCC20,.20SQ,25 | HVQCCN, LCC20,.20SQ,25 | HVQCCN, LCC20,.20SQ,25 |
针数 | 20 | - | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | _compli | - | not_compliant | _compli | _compli | _compli | _compli |
转换器类型 | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY | - | BINARY | BINARY | BINARY | BINARY | BINARY |
JESD-30 代码 | S-XQCC-N20 | - | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 |
长度 | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
最大线性误差 (EL) | 0.0977% | - | 0.1953% | 0.0977% | 0.1953% | 0.0977% | 0.0244% |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 |
位数 | 10 | - | 8 | 10 | 8 | 12 | 12 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC20,.20SQ,25 | - | LCC20,.20SQ,25 | LCC20,.20SQ,25 | LCC20,.20SQ,25 | LCC20,.20SQ,25 | LCC20,.20SQ,25 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 245 | - | 245 | 245 | 245 | 245 | 245 |
电源 | 2/5,3/5 V | - | 2/5,3/5 V | 2/5,3/5 V | 2/5,3/5 V | 2/5,3/5 V | 2/5,3/5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
最大稳定时间 | 6 µs | - | 4 µs | 6 µs | 4 µs | 6 µs | 6 µs |
标称安定时间 (tstl) | 2.5 µs | - | 2 µs | 2.5 µs | 2 µs | 3 µs | 3 µs |
最大压摆率 | 4 mA | - | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA |
标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子节距 | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved