SRAM Module, 32KX32, 85ns, CMOS, CPGA66
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | PGA, PGA66,11X11 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 85 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-XPGA-P66 |
| JESD-609代码 | e0 |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 32 |
| 端子数量 | 66 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 32KX32 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | PGA |
| 封装等效代码 | PGA66,11X11 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 最大待机电流 | 0.012 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.28 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| Base Number Matches | 1 |
| PUMA2S1000MB-85 | PUMA2S1000MB-12 | PUMA2S1000M-10 | PUMA2S1000-70 | PUMA2S1000-85 | PUMA2S1000L-85 | PUMA2S1000-12 | PUMA2S1000LMB-85 | PUMA2S1000LI-12 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 32KX32, 85ns, CMOS, CPGA66 | SRAM Module, 32KX32, 120ns, CMOS, CPGA66 | SRAM Module, 32KX32, 100ns, CMOS, CPGA66 | SRAM Module, 32KX32, 70ns, CMOS, CPGA66 | SRAM Module, 32KX32, 85ns, CMOS, CPGA66 | SRAM Module, 32KX32, 85ns, CMOS, CPGA66 | SRAM Module, 32KX32, 120ns, CMOS, CPGA66 | SRAM Module, 32KX32, 85ns, CMOS, CPGA66 | SRAM Module, 32KX32, 120ns, CMOS, CPGA66 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 85 ns | 120 ns | 100 ns | 70 ns | 85 ns | 85 ns | 120 ns | 85 ns | 120 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - | - | - | - | -55 °C | -40 °C |
| 组织 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | PGA | PGA | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| 封装等效代码 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.012 A | 0.0008 A | 0.012 A | 0.012 A | 0.012 A | 0.00068 A | 0.0008 A | 0.00068 A | 0.0002 A |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 2 V | 4.5 V | 2 V | 2 V |
| 最大压摆率 | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA | 0.28 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 厂商名称 | - | - | - | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc |
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