IC,OVERVOLTAGE PROTECTOR,BICMOS,LLCC,6PIN,PLASTIC
IC,OVERVOLTAGE PROTECTOR,BICMOS,LLCC,6PIN,塑料
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
包装说明 | TDFN-6 |
Reach Compliance Code | _compli |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
可调阈值 | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-N6 |
JESD-609代码 | e0 |
长度 | 3 mm |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 6 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装等效代码 | SOLCC6,.11,37 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 14 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电流 (Isup) | 0.13 mA |
最大供电电压 (Vsup) | 72 V |
最小供电电压 (Vsup) | 5.5 V |
标称供电电压 (Vsup) | 14 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 0.95 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
MAX6398ATT | MAX6397-ATA-T | MAX6397ZATA | MAX6397TATA | MAX6397YATA | MAX6397MATA | MAX6397WATA | MAX6397SATA | MAX6397VATA | MAX6397LATA | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | IC,OVERVOLTAGE PROTECTOR,BICMOS,LLCC,6PIN,PLASTIC | 1-CHANNEL POWER SUPPLY SUPPORT CKT, DSO6 | IC,OVERVOLTAGE PROTECTOR,BICMOS,LLCC,8PIN,PLASTIC | 1-CHANNEL POWER SUPPLY SUPPORT CKT, DSO6 | IC,OVERVOLTAGE PROTECTOR,BICMOS,LLCC,8PIN,PLASTIC | IC,OVERVOLTAGE PROTECTOR,BICMOS,LLCC,8PIN,PLASTIC | 1-CHANNEL POWER SUPPLY SUPPORT CKT, DSO6 | IC,OVERVOLTAGE PROTECTOR,BICMOS,LLCC,8PIN,PLASTIC | 1-CHANNEL POWER SUPPLY SUPPORT CKT, DSO6 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, DSO6 |
可调阈值 | YES | Yes | YES | YES | YES | YES | YES | YES | YES | YES |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 6 | 6 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
表面贴装 | YES | Yes | YES | YES | YES | YES | YES | YES | YES | YES |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | NO LEAD | NO 铅 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | DUAL | 双 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
包装说明 | TDFN-6 | - | HVSON, SOLCC8,.12,25 | HVSON, SOLCC8,.12,25 | HVSON, SOLCC8,.12,25 | HVSON, SOLCC8,.12,25 | HVSON, SOLCC8,.12,25 | TDFN-8 | HVSON, SOLCC8,.12,25 | TDFN-8 |
Reach Compliance Code | _compli | - | _compli | _compli | _compli | _compli | _compli | _compli | _compli | _compli |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-N6 | - | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
信道数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | - | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON |
封装等效代码 | SOLCC6,.11,37 | - | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 14 V | - | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
最大供电电流 (Isup) | 0.13 mA | - | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA | 0.14 mA |
最大供电电压 (Vsup) | 72 V | - | 72 V | 72 V | 72 V | 72 V | 72 V | 72 V | 72 V | 72 V |
最小供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
标称供电电压 (Vsup) | 14 V | - | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V | 14 V |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | 0.95 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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