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PT7C5027A4-2WF

产品描述Analog Circuit,
产品类别模拟混合信号IC    信号电路   
文件大小415KB,共8页
制造商Diodes Incorporated
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PT7C5027A4-2WF概述

Analog Circuit,

PT7C5027A4-2WF规格参数

参数名称属性值
包装说明, WAFER
Reach Compliance Codecompliant
最高工作温度85 °C
最低工作温度-40 °C
封装等效代码WAFER
电源1.5/5.5 V
认证状态Not Qualified
温度等级INDUSTRIAL
Base Number Matches1

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Data Sheet
PT7C5027 series
Crystal Oscillator
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features
Wide range of operating supply voltage: 1.50V to
5.5V
Regulated voltage drive oscillator circuit for
reduced power consumption and crystal drive
current
Optimized low crystal drive current oscillation for
miniature crystal units
PT7C5027Axseries: for Flip Chip Bonding
PT7C5027Bxseries: for Wire Bonding (type
Ⅰ)
PT7C5027Cxseries: for Wire Bonding (type
Ⅱ)
Recommended oscillation frequency range
Low frequency version: 10MHz to 60MHz
Multi-stage frequency divider for low-frequency
output support: 0.9MHz(min)
Frequency divider built-in:
Selectable by version: f0, f0/2, f0/4, f0/8, f0/16,
f0/32, f0/64
-40 to 85℃ operating temperature range
Standy function
High impedence in standby mode, oscillator stops
CMOS output duty level(1/2VDD)
50±5% output duty
15pF output drive capability
Die form or Wafer form
PT7C
PT7C
Device Type
Clock Series
XO 5027 Series
5014
5027
A
Description
The PT7C5027 series are miniature crystal
oscillator module ICs. The oscillator circuit stage has
voltage regulator drive, significantly reducing current
consumption and crystal current, compared with
existing devices, and significantly reducing the
oscillator characteristics supply voltage dependency.
Application
Used for crystal oscillator
Ordering Information
Part no.
PT7C5027Ax-2DE
PT7C5027Ax-2WF
PT7C5027Bx-5GDE
PT7C5027Bx-5GWF
PT7C5027Cx-2DE
PT7C5027Cx-2WF
PT7C5027Cx-5GDE
PT7C5027Cx-5GWF
Package type
Die form
Wafer form
Die form
Wafer form
Die form
Wafer form
Die form
Wafer form
Note:
1.Below is the detailed definition of part no.
2. “-2” means die thickness is 220±20µm; “-5G”
means die thickness is 130±15µm without coating.
AL
1
1
Oscillation frequency range,
frequency divider function
Suffix
1
2
3
4
5
6
7
f
out
f
O
f
O
/2
f
O
/4
f
O
/8
f
O
/16
f
O
/32
f
O
/64
Frequency range
Pad layout type
A: for Flip Chip Bonding
B: for Wire Bonding(type I)
C: for Wire Bonding(type II)
20 to 60MHz
PT0276(06/08)
1
Ver:2

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