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PALCE26V12H-15JI/4

产品描述EE PLD, 15ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28
产品类别可编程逻辑器件    可编程逻辑   
文件大小211KB,共21页
制造商AMD(超微)
官网地址http://www.amd.com
下载文档 详细参数 选型对比 全文预览

PALCE26V12H-15JI/4概述

EE PLD, 15ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28

PALCE26V12H-15JI/4规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码QLCC
包装说明QCCJ, LDCC28,.5SQ
针数28
Reach Compliance Codeunknown
其他特性12 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 2 EXTERNAL CLOCKS
架构PAL-TYPE
最大时钟频率50 MHz
JESD-30 代码S-PQCC-J28
JESD-609代码e0
长度11.5062 mm
专用输入次数12
I/O 线路数量12
输入次数26
输出次数12
产品条款数136
端子数量28
最高工作温度85 °C
最低工作温度-40 °C
组织12 DEDICATED INPUTS, 12 I/O
输出函数MACROCELL
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC28,.5SQ
封装形状SQUARE
封装形式CHIP CARRIER
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
可编程逻辑类型EE PLD
传播延迟15 ns
认证状态Not Qualified
座面最大高度4.572 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度11.5062 mm
Base Number Matches1

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FINAL
COM’L: H-7/10/15/20
IND: H-10/15/20
PALCE26V12 Family
28-Pin EE CMOS Versatile PAL Device
DISTINCTIVE CHARACTERISTICS
s
28-pin versatile PAL programmable logic
device architecture
s
Electrically erasable CMOS technology
provides half power (only 115 mA) at high
speed (7.5 ns propagation delay)
s
14 dedicated inputs and 12 input/output
macrocells for architectural flexibility
s
Macrocells can be registered or combinatorial,
and active high or active low
s
Varied product term distribution allows up to
16 product terms per output
s
Two clock inputs for independent functions
s
Global asynchronous reset and synchronous
preset for initialization
s
Register preload for testability and built-in
register reset on power-up
s
Space-efficient 28-pin SKINNYDIP and PLCC
packages
s
Center VCC and GND pins to improve signal
characteristics
s
Extensive third-party software and programmer
support through FusionPLD partners
GENERAL DESCRIPTION
The PALCE26V12 is a 28-pin version of the popular
PAL22V10 architecture. Built with low-power, high-
speed, electrically-erasable CMOS technology, the
PALCE26V12 offers many unique advantages.
Device logic is automatically configured according to
the user’s design specification. Design is simplified by
design software, allowing automatic creation of a
programming file based on Boolean or state equations.
The software can also be used to verify the design and
can provide test vectors for the programmed device.
The PALCE26V12 utilizes the familiar sum-of-products
(AND/OR) architecture that allows users to implement
complex logic functions easily and efficiently. Multiple
levels of combinatorial logic can always be reduced
to sum-of-products form, taking advantage of the
very wide input gates available in PAL devices. The
functions are programmed into the device through
electrically-erasable floating-gate cells in the AND logic
array and the macrocells. In the unprogrammed state,
all AND product terms float HIGH. If both true and
complement of any input are connected, the term will be
permanently LOW.
The product terms are connected to the fixed OR array
with a varied distribution from 8 to 16 across the outputs
(see Block Diagram). The OR sum of the products feeds
the output macrocell. Each macrocell can be pro-
grammed as registered or combinatorial, active high or
active low, with registered I/O possible. The flip-flop can
be clocked by one of two clock inputs. The output
configuration is determined by four bits controlling three
multiplexers in each macrocell.
AMD’s FusionPLD program allows PALCE26V12
designs to be implemented using a wide variety of
popular industry-standard design tools. By working
closely with the FusionPLD partners, AMD certifies that
the tools provide accurate, quality support. By ensuring
that third-party tools are available, costs are lowered
because a designer does not have to buy a complete set
of new tools for each device. The FusionPLD program
also greatly reduces design time since a designer can
use a tool that is already installed and familiar. Please
refer to the PLD Software Reference Guide for certified
development systems and the Programmer Reference
Guide for approved programmers.
2-306
Publication#
16072
Rev.
E
Issue Date:
February 1996
Amendment
/0

PALCE26V12H-15JI/4相似产品对比

PALCE26V12H-15JI/4 PALCE26V12H-7PC PALCE26V12H-10PC/4 PALCE26V12H-10PI/4 PALCE26V12H-15PI/4 PALCE26V12H-20JI/4 PALCE26V12H-7JC/4
描述 EE PLD, 15ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 28-pin EE cmos versatile pal device EE PLD, 10ns, PAL-Type, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 EE PLD, 10ns, PAL-Type, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 EE PLD, 15ns, PAL-Type, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 EE PLD, 20ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 EE PLD, 8ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28
是否Rohs认证 不符合 - 不符合 不符合 不符合 不符合 不符合
零件包装代码 QLCC - DIP DIP DIP QLCC QLCC
包装说明 QCCJ, LDCC28,.5SQ - DIP, DIP28,.3 DIP, DIP28,.3 DIP, DIP28,.3 QCCJ, LDCC28,.5SQ QCCJ, LDCC28,.5SQ
针数 28 - 28 28 28 28 28
Reach Compliance Code unknown - unknown unknown unknown unknown unknown
其他特性 12 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 2 EXTERNAL CLOCKS - 12 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 2 EXTERNAL CLOCKS 12 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 2 EXTERNAL CLOCKS 12 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 2 EXTERNAL CLOCKS 12 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 2 EXTERNAL CLOCKS 12 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 2 EXTERNAL CLOCKS
架构 PAL-TYPE - PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE
最大时钟频率 50 MHz - 71.4 MHz 71.4 MHz 50 MHz 40 MHz 105.3 MHz
JESD-30 代码 S-PQCC-J28 - R-PDIP-T28 R-PDIP-T28 R-PDIP-T28 S-PQCC-J28 S-PQCC-J28
JESD-609代码 e0 - e0 e0 e0 e0 e0
长度 11.5062 mm - 35.2425 mm 35.2425 mm 35.2425 mm 11.5062 mm 11.5062 mm
专用输入次数 12 - 12 12 12 12 12
I/O 线路数量 12 - 12 12 12 12 12
输入次数 26 - 26 26 26 26 26
输出次数 12 - 12 12 12 12 12
产品条款数 136 - 136 136 136 136 136
端子数量 28 - 28 28 28 28 28
最高工作温度 85 °C - 75 °C 85 °C 85 °C 85 °C 75 °C
最低工作温度 -40 °C - - -40 °C -40 °C -40 °C -
组织 12 DEDICATED INPUTS, 12 I/O - 12 DEDICATED INPUTS, 12 I/O 12 DEDICATED INPUTS, 12 I/O 12 DEDICATED INPUTS, 12 I/O 12 DEDICATED INPUTS, 12 I/O 12 DEDICATED INPUTS, 12 I/O
输出函数 MACROCELL - MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QCCJ - DIP DIP DIP QCCJ QCCJ
封装等效代码 LDCC28,.5SQ - DIP28,.3 DIP28,.3 DIP28,.3 LDCC28,.5SQ LDCC28,.5SQ
封装形状 SQUARE - RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE
封装形式 CHIP CARRIER - IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V - 5 V 5 V 5 V 5 V 5 V
可编程逻辑类型 EE PLD - EE PLD EE PLD EE PLD EE PLD EE PLD
传播延迟 15 ns - 10 ns 10 ns 15 ns 20 ns 8 ns
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.572 mm - 5.08 mm 5.08 mm 5.08 mm 4.572 mm 4.572 mm
最大供电电压 5.5 V - 5.25 V 5.5 V 5.5 V 5.5 V 5.25 V
最小供电电压 4.5 V - 4.75 V 4.5 V 4.5 V 4.5 V 4.75 V
标称供电电压 5 V - 5 V 5 V 5 V 5 V 5 V
表面贴装 YES - NO NO NO YES YES
技术 CMOS - CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL - COMMERCIAL EXTENDED INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL EXTENDED
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 J BEND - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND J BEND
端子节距 1.27 mm - 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 QUAD - DUAL DUAL DUAL QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 11.5062 mm - 7.62 mm 7.62 mm 7.62 mm 11.5062 mm 11.5062 mm
Base Number Matches 1 - 1 1 1 1 1
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