4K X 8 UVPROM, 55 ns, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 24 |
Reach Compliance Code | unknown |
最长访问时间 | 55 ns |
JESD-30 代码 | R-GDIP-T24 |
JESD-609代码 | e0 |
内存密度 | 32768 bit |
内存集成电路类型 | UVPROM |
内存宽度 | 8 |
湿度敏感等级 | NOT SPECIFIED |
功能数量 | 1 |
端子数量 | 24 |
字数 | 4096 words |
字数代码 | 4000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 4KX8 |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | COMMERCIAL |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
CY7C243-55WC | CY7C243-25JC | CY7C243-25PC | CY7C244-20WC | CY7C244-25PC | CY7C243-45PC | CY7C244-55WC | CY7C244-45WC | CY7C243-25WC | |
---|---|---|---|---|---|---|---|---|---|
描述 | 4K X 8 UVPROM, 55 ns, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | 4K X 8 OTPROM, 25 ns, PQCC28, PLASTIC, LCC-28 | 4K X 8 OTPROM, 25 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 4K X 8 UVPROM, 20 ns, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | 4K X 8 OTPROM, 25 ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | 4K X 8 OTPROM, 45 ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 4K X 8 UVPROM, 55 ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | 4K X 8 UVPROM, 45 ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | 4K X 8 UVPROM, 25 ns, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | QLCC | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, | QCCJ, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
针数 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 55 ns | 25 ns | 25 ns | 20 ns | 25 ns | 45 ns | 55 ns | 45 ns | 25 ns |
JESD-30 代码 | R-GDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | R-GDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
内存集成电路类型 | UVPROM | OTP ROM | OTP ROM | UVPROM | OTP ROM | OTP ROM | UVPROM | UVPROM | UVPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | QCCJ | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | - | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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