Standard SRAM, 4KX4, 30ns, CMOS, CDIP20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | unknown |
最长访问时间 | 30 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDIP-T20 |
JESD-609代码 | e0 |
内存密度 | 16384 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
端子数量 | 20 |
字数 | 4096 words |
字数代码 | 4000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 4KX4 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
最小待机电流 | 2 V |
最大压摆率 | 0.1 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
P4C168L-30DMB | P4C168L-25DC | P4C168L-30DC | P4C168L-30DM | P4C168L-30PC | P4C168L-35DC | P4C168L-35PC | P4C168L-35SC | P4C169-30DC | P4C169-30DMB | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 4KX4, 30ns, CMOS, CDIP20 | Standard SRAM, 4KX4, 25ns, CMOS, CDIP20 | Standard SRAM, 4KX4, 30ns, CMOS, CDIP20 | Standard SRAM, 4KX4, 30ns, CMOS, CDIP20 | Standard SRAM, 4KX4, 30ns, CMOS, PDIP20 | Standard SRAM, 4KX4, 35ns, CMOS, CDIP20 | Standard SRAM, 4KX4, 35ns, CMOS, PDIP20 | Standard SRAM, 4KX4, 35ns, CMOS, PDSO20 | Standard SRAM, 4KX4, 30ns, CMOS, CDIP20 | Standard SRAM, 4KX4, 30ns, CMOS, CDIP20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 30 ns | 25 ns | 30 ns | 30 ns | 30 ns | 35 ns | 35 ns | 35 ns | 30 ns | 30 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-XDIP-T20 | R-XDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
组织 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | SOP | DIP | DIP |
封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 | DIP20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 4.5 V | 4.5 V |
最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.12 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
包装说明 | - | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 |
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