10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8
10EL 系列, 正边沿触发D触发器, 互补输出, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | SOIC |
| 包装说明 | PLASTIC, TSSOP-8 |
| 针数 | 8 |
| Reach Compliance Code | _compli |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
| 系列 | 10EL |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Su | 2200000000 Hz |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | -5.2 V |
| 最大电源电流（ICC） | 29 mA |
| Prop。Delay @ Nom-Su | 0.62 ns |
| 传播延迟（tpd） | 0.565 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.7 V |
| 最小供电电压 (Vsup) | 4.2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 3 mm |
| 最小 fmax | 2200 MHz |
| MC10EL51DTR2 | MC10EL51 | MC10EL51MNR4G | MC10EL51_06 | MC10EL51MNR4 | MC100EL51MNR4G | MC100EL51MNR4 | MC100EL51 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 | 10EL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO8 |
| 系列 | 10EL | 10EL | 10EL | 10EL | 10EL | 100EL | 100EL | 10EL |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 表面贴装 | YES | Yes | YES | Yes | YES | YES | YES | Yes |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 是否Rohs认证 | 不符合 | - | 符合 | - | 不符合 | 符合 | 不符合 | - |
| 厂商名称 | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - |
| 零件包装代码 | SOIC | - | DFN | - | DFN | DFN | DFN | - |
| 包装说明 | PLASTIC, TSSOP-8 | - | HVSON, SOLCC8,.08,20 | - | HVSON, SOLCC8,.08,20 | HVSON, SOLCC8,.08,20 | DFN-8 | - |
| 针数 | 8 | - | 8 | - | 8 | 8 | 8 | - |
| Reach Compliance Code | _compli | - | compli | - | _compli | compli | compli | - |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V | - | NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V | - | NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V | NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V | NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V | - |
| JESD-30 代码 | S-PDSO-G8 | - | S-XDSO-N8 | - | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | - |
| 长度 | 3 mm | - | 2 mm | - | 2 mm | 2 mm | 2 mm | - |
| 逻辑集成电路类型 | D FLIP-FLOP | - | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - |
| 最大频率@ Nom-Su | 2200000000 Hz | - | 2200000000 Hz | - | 2200000000 Hz | 1800000000 Hz | 1800000000 Hz | - |
| 最高工作温度 | 85 °C | - | 85 °C | - | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | - | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | TSSOP | - | HVSON | - | HVSON | HVSON | HVSON | - |
| 封装等效代码 | TSSOP8,.19 | - | SOLCC8,.08,20 | - | SOLCC8,.08,20 | SOLCC8,.08,20 | SOLCC8,.08,20 | - |
| 封装形状 | SQUARE | - | SQUARE | - | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 包装方法 | TAPE AND REEL | - | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
| 峰值回流温度（摄氏度） | 240 | - | 260 | - | 240 | 260 | 240 | - |
| 电源 | -5.2 V | - | -5.2 V | - | -5.2 V | -4.5 V | -4.5 V | - |
| 最大电源电流（ICC） | 29 mA | - | 29 mA | - | 29 mA | 36 mA | 36 mA | - |
| Prop。Delay @ Nom-Su | 0.62 ns | - | 0.62 ns | - | 0.62 ns | 0.62 ns | 0.62 ns | - |
| 传播延迟（tpd） | 0.565 ns | - | 0.565 ns | - | 0.565 ns | 0.565 ns | 0.565 ns | - |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.1 mm | - | 1 mm | - | 1 mm | 1 mm | 1 mm | - |
| 最大供电电压 (Vsup) | 5.7 V | - | 5.7 V | - | 5.7 V | 5.7 V | 5.7 V | - |
| 最小供电电压 (Vsup) | 4.2 V | - | 4.2 V | - | 4.2 V | 4.2 V | 4.2 V | - |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | - | 5 V | 5 V | 5 V | - |
| 技术 | ECL | - | ECL | - | ECL | ECL | ECL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | MATTE TIN | - | Tin/Lead (Sn/Pb) | Nickel/Gold/Palladium (Ni/Au/Pd) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 0.65 mm | - | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 处于峰值回流温度下的最长时间 | 30 | - | 40 | - | 30 | 40 | 30 | - |
| 宽度 | 3 mm | - | 2 mm | - | 2 mm | 2 mm | 2 mm | - |
| 最小 fmax | 2200 MHz | - | 2200 MHz | - | 2200 MHz | 2200 MHz | 2200 MHz | - |
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