HDBL101G thru HDBL107G
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated junction
- Ideal for printed circuit board
- Reliable low cost construction utilizing molded plastic technique
- High surge current capability
- UL Recognized File # E-326854
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
Glass Passivated High Efficient Bridge Rectifiers
DBL
MECHANICAL DATA
Case:
Molded plastic body
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
Polarity:
Polarity as marked on the body
Weight:
0.36 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Rating for fusing (t<8.3ms)
Maximum instantaneous forward voltage (Note 1)
I
F
= 1 A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time (Note 2)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse Test with PW=300μs,1% Duty Cycle
Notes 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
T
J
=25
℃
T
J
=125℃
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
I
2
t
V
F
I
R
Trr
R
θjL
R
θjA
T
J
T
STG
50
15
40
- 55 to + 150
- 55 to + 150
1.0
HDBL
101G
50
35
50
HDBL
102G
100
70
100
HDBL
103G
200
140
200
HDBL
104G
400
280
400
1
50
10.3
1.3
5
500
75
O
HDBL
105G
600
420
600
HDBL
106G
800
560
800
HDBL
107G
1000
700
1000
UNIT
V
V
V
A
A
A
2
s
1.7
V
μA
ns
C/W
O
O
C
C
Document Number: DS_D1311010
Version: E13
HDBL101G thru HDBL107G
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
HDBL10xG
(Note 1)
PACKING CODE
GREEN COMPOUND
CODE
C1
Suffix "G"
DBL
50 / TUBE
PACKAGE
PACKING
Note 1: "x" defines voltage from 50V (HDBL101G) to 1000V (HDBL107G)
EXAMPLE
PREFERRED P/N
HDBL107G C1
HDBL107G C1
PART NO.
HDBL107G
HDBL107G
PACKING CODE
C1
C1
G
Green compound
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
10
INSTANTANEOUS FORWARD CURRENT (A)
HDBL101G -
HDBL104G
HDBL105G
FIG.1 FORWARD CURRENT DERATING CURVE
1.5
AVERAGE FORWARD CURRENT .
(A)
1
0.5
RESISTIVE OR
INDUCTION LOAD
0
0
20
40
60
80
100
120
140
160
AMBIENT TEMPERATURE (
o
C)
1
HDBL106G -
HDBL107G
0.1
0.4
0.6
0.8
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT (A)
70
60
50
40
30
20
10
0
1
10
NUMBER OF CYCLES AT 60 Hz
100
8.3ms Single Half Sine Wave
(JEDEC Method)
1000
INSTANTANEOUS REVERSE CURRENT (μA)
1
1.2
1.4
FORWARD VOLTAGE (V)
1.6
1.8
2
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
100
TJ=125℃
10
1
TJ=25℃
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Document Number: DS_D1311010
Version: E13
HDBL101G thru HDBL107G
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
70
60
CAPACITANCE (pF)
A
50
40
30
20
10
0
0.1
1
10
REVERSE VOLTAGE (V)
100
1000
HDBL106G -
HDBL107G
HDBL101G -
HDBL105G
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
6.20
7.24
8.12
2.40
0.89
0.46
5.00
1.39
1.27
3.81
0.22
7.600
Max
6.50
8.00
8.51
2.60
1.14
0.58
5.20
1.90
2.03
4.69
0.33
8.90
Unit (inch)
Min
0.244
0.285
0.320
0.094
0.035
0.018
0.197
0.055
0.050
0.150
0.009
0.299
Max
0.256
0.315
0.335
0.102
0.045
0.023
0.205
0.075
0.080
0.185
0.013
0.350
DIM.
A
B
C
D
E
F
G
H
I
J
K
L
MARKING DIAGRAM
P/N
G
YW
F
= Specific Device Code
= Green Compound
= Date Code
= Factory Code
Document Number: DS_D1311010
Version: E13
HDBL101G thru HDBL107G
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1311010
Version: E13
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
