1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQCC20, GREEN, PLASTIC, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QLCC |
| 包装说明 | GREEN, PLASTIC, LCC-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 最大模拟输入电压 | 8.1 V |
| 最小模拟输入电压 | -0.1 V |
| 最长转换时间 | 2.5 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | S-PQCC-J20 |
| JESD-609代码 | e3 |
| 长度 | 8.965 mm |
| 最大线性误差 (EL) | 0.3906% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 采样速率 | 0.625 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 4.57 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.965 mm |
| Base Number Matches | 1 |
| TLC0820AIFN | TLC0820AIDW | TLC0820AIN | TLC0820ACDW | TLC0820ACN | TLC0820ACFN | ADC0820CCIN | |
|---|---|---|---|---|---|---|---|
| 描述 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQCC20, GREEN, PLASTIC, LCC-20 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO20, GREEN, PLASTIC, SOIC-20 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, ROHS COMPLIANT, PLASTIC, DIP-20 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO20, GREEN, PLASTIC, SOIC-20 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, ROHS COMPLIANT, PLASTIC, DIP-20 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQCC20, GREEN, PLASTIC, LCC-20 | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | QLCC | SOIC | DIP | SOIC | DIP | QLCC | DIP |
| 包装说明 | GREEN, PLASTIC, LCC-20 | GREEN, PLASTIC, SOIC-20 | ROHS COMPLIANT, PLASTIC, DIP-20 | GREEN, PLASTIC, SOIC-20 | ROHS COMPLIANT, PLASTIC, DIP-20 | GREEN, PLASTIC, LCC-20 | DIP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最大模拟输入电压 | 8.1 V | 8.1 V | 8.1 V | 8.1 V | 8.1 V | 8.1 V | 10.2 V |
| 最小模拟输入电压 | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.2 V |
| 最长转换时间 | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | S-PQCC-J20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | S-PQCC-J20 | R-PDIP-T20 |
| JESD-609代码 | e3 | e4 | e4 | e4 | e4 | e3 | e0 |
| 长度 | 8.965 mm | 12.8 mm | 25.4 mm | 12.8 mm | 25.4 mm | 8.965 mm | 24.51 mm |
| 最大线性误差 (EL) | 0.3906% | 0.3906% | 0.3906% | 0.3906% | 0.3906% | 0.3906% | 0.39% |
| 湿度敏感等级 | 1 | 1 | NOT APPLICABLE | 1 | NOT APPLICABLE | 1 | NOT SPECIFIED |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | - | - | -40 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | SOP | DIP | SOP | DIP | QCCJ | DIP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 采样速率 | 0.625 MHz | 0.625 MHz | 0.625 MHz | 0.625 MHz | 0.625 MHz | 0.625 MHz | 0.625 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 4.57 mm | 2.65 mm | 5.08 mm | 2.65 mm | 5.08 mm | 4.57 mm | 5.08 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | TIN | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | TIN | TIN LEAD |
| 端子形式 | J BEND | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8.965 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.62 mm | 8.965 mm | 7.62 mm |
| Is Samacsys | N | N | N | N | N | N | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
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