IC,UART,CMOS,DIP,28PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e0 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| NSC858NI/A+ | NSC858J/A+ | NSC858DI/A+ | NSC858JI/A+ | NSC858EI/A+ | NSC858N/B+ | |
|---|---|---|---|---|---|---|
| 描述 | IC,UART,CMOS,DIP,28PIN,PLASTIC | IC,UART,CMOS,DIP,28PIN,CERAMIC | IC,UART,CMOS,DIP,28PIN,CERAMIC | IC,UART,CMOS,DIP,28PIN,CERAMIC | IC,UART,CMOS,LLCC,28PIN,CERAMIC | IC,UART,CMOS,DIP,28PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCN, LCC28,.45SQ | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N | N | N |
| JESD-30 代码 | R-PDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | S-XQCC-N28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | QCCN | DIP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | LCC28,.45SQ | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 表面贴装 | NO | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
电源技术
DIY/开源硬件专区
FPGA/CPLD
测试/测量
嵌入式系统
测试/测量
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