2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ,TSOP2-44/40
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | TSOP2 |
| 包装说明 | TSOP2, TSOP40/44,.46,32 |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 48 ns |
| 命令用户界面 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-PDSO-G40 |
| JESD-609代码 | e0 |
| 长度 | 18.41 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 部门数/规模 | 512 |
| 端子数量 | 40 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 组织 | 2MX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装等效代码 | TSOP40/44,.46,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 页面大小 | 256 words |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 座面最大高度 | 1.2 mm |
| 部门规模 | 4K |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.08 mA |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | NO |
| 类型 | NAND TYPE |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |
| NM29N16ES | NM29N16S | NM29N16R | NM29N16ESX | NM29N16SX | NM29N16ER | NM29N16ERX | NM29N16RX | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ,TSOP2-44/40 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ,TSOP2-44/40 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ, REVERSE, TSOP2-44/40 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ,TSOP2-44/40 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ,TSOP2-44/40 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ, REVERSE, TSOP2-44/40 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ, REVERSE, TSOP2-44/40 | 2MX8 FLASH 5V PROM, 48ns, PDSO40, 0.400 INCH, EIAJ, REVERSE, TSOP2-44/40 |
| 零件包装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
| 包装说明 | TSOP2, TSOP40/44,.46,32 | TSOP2, TSOP40/44,.46,32 | TSOP2-R, TSOP40/44,.46,32 | TSOP2, | TSOP2, | TSOP2-R, TSOP40/44,.46,32 | TSOP2-R, | TSOP2-R, |
| 针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 48 ns | 48 ns | 48 ns | 48 ns | 48 ns | 48 ns | 48 ns | 48 ns |
| JESD-30 代码 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 |
| 长度 | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2 | TSOP2-R | TSOP2 | TSOP2 | TSOP2-R | TSOP2-R | TSOP2-R |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | COMMERCIAL | COMMERCIAL | OTHER | COMMERCIAL | OTHER | OTHER | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
| Is Samacsys | N | N | N | N | N | N | N | - |
| 类型 | NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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