LS SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, DFP-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 16 |
Reach Compliance Code | unknown |
Is Samacsys | N |
系列 | LS |
JESD-30 代码 | R-GDFP-F16 |
JESD-609代码 | e0 |
长度 | 10.16 mm |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 4 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
传播延迟(tpd) | 25 ns |
认证状态 | COMMERCIAL |
座面最大高度 | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 6.73 mm |
最小 fmax | 30 MHz |
Base Number Matches | 1 |
SN54LS175W | SN54174J | SN54LS174FK | SN54LS175FK | SN54175W | SN54174W | SN54LS174W | SN74S175NSR | |
---|---|---|---|---|---|---|---|---|
描述 | LS SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, DFP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, CDIP16, CERAMIC, DIP-16 | D Flip-Flop, LS Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, CQCC20, CERAMIC, CC-20 | LS SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, CC-20 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDFP16, CERAMIC, DFP-16 | D Flip-Flop, TTL/H/L Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, CDFP16, CERAMIC, DFP-16 | D Flip-Flop, LS Series, 1-Func, Positive Edge Triggered, 6-Bit, True Output, TTL, CDFP16, CERAMIC, FP-16 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, PDSO16, GREEN, SOP-16 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
零件包装代码 | DFP | DIP | QFN | QFN | DFP | DFP | DFP | SOIC |
包装说明 | DFP, | DIP, | QCCN, | QCCN, | DFP, | DFP, | DFP, | SOP, |
针数 | 16 | 16 | 20 | 20 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | LS | TTL/H/L | LS | LS | TTL/H/L | TTL/H/L | LS | S |
JESD-30 代码 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F16 | R-GDFP-F16 | R-GDFP-F16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e4 |
长度 | 10.16 mm | 19.56 mm | 8.89 mm | 8.89 mm | 10.2 mm | 10.2 mm | 9.79 mm | 10.2 mm |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 4 | 6 | 6 | 4 | 4 | 6 | 6 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 20 | 20 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
输出极性 | COMPLEMENTARY | TRUE | TRUE | COMPLEMENTARY | COMPLEMENTARY | TRUE | TRUE | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | DFP | DIP | QCCN | QCCN | DFP | DFP | DFP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 |
传播延迟(tpd) | 25 ns | 35 ns | 30 ns | 25 ns | 35 ns | 35 ns | 30 ns | 17 ns |
认证状态 | COMMERCIAL | Not Qualified | Not Qualified | COMMERCIAL | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm | 2.03 mm | 2.03 mm | 2.03 mm | 2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | NICKEL PALLADIUM GOLD |
端子形式 | FLAT | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | FLAT | FLAT | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 6.73 mm | 7.62 mm | 8.89 mm | 8.89 mm | 6.73 mm | 6.73 mm | 6.73 mm | 5.3 mm |
最小 fmax | 30 MHz | 25 MHz | 30 MHz | 30 MHz | 25 MHz | 25 MHz | 30 MHz | 75 MHz |
厂商名称 | - | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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