SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
| 参数名称 | 属性值 |
| 包装说明 | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| Is Samacsys | N |
| 最长访问时间 | 20 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PQCC-J68 |
| 长度 | 25.273 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128KX32 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大待机电流 | 0.02 A |
| 最小待机电流 | 4.75 V |
| 最大压摆率 | 0.6 mA |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 25.273 mm |
| Base Number Matches | 1 |
| EDI8L32128C20AI | EDI8L32128C15AC | EDI8L32128C12AC | EDI8L32128C20AC | EDI8L32128C17AI | EDI8L32128C15AI | EDI8L32128C17AC | |
|---|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 | SRAM Module, 128KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 |
| 包装说明 | QCCJ, LDCC68,1.0SQ | LCC-68 | LCC-68 | LCC-68 | QCCJ, LDCC68,1.0SQ | LCC-68 | LCC-68 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 20 ns | 15 ns | 12 ns | 20 ns | 17 ns | 15 ns | 17 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
| 长度 | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
| 可输出 | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
| 最大待机电流 | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| 最小待机电流 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 最大压摆率 | 0.6 mA | 0.68 mA | 0.72 mA | 0.6 mA | 0.64 mA | 0.68 mA | 0.64 mA |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | - | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc | - | Mercury Systems Inc | Mercury Systems Inc |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
