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MVSMCJ18

产品描述Trans Voltage Suppressor Diode, 1500W, 18V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, PLASTIC PACKAGE-2
产品类别分立半导体    二极管   
文件大小212KB,共4页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

MVSMCJ18概述

Trans Voltage Suppressor Diode, 1500W, 18V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, PLASTIC PACKAGE-2

MVSMCJ18规格参数

参数名称属性值
是否Rohs认证不符合
Objectid2035818616
零件包装代码DO-214AB
包装说明PLASTIC PACKAGE-2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
YTEOL0
最大击穿电压24.4 V
最小击穿电压20 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码DO-214AB
JESD-30 代码R-PDSO-C2
JESD-609代码e0
湿度敏感等级1
最大非重复峰值反向功率耗散1500 W
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
极性UNIDIRECTIONAL
最大功率耗散1.56 W
认证状态Not Qualified
最大重复峰值反向电压18 V
表面贴装YES
技术AVALANCHE
端子面层TIN LEAD
端子形式C BEND
端子位置DUAL

文档预览

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SMCJ5.0 thru SMCJ170CA, e3
and SMCG5.0 thru SMCG170CA, e3
SCOTTSDALE DIVISION
SURFACE MOUNT 1500 Watt
Transient Voltage Suppressor
DESCRIPTION
The SMCJ5.0-170A or SMCG5.0-170A series of 1500 W Transient Voltage
Suppressors (TVSs) protects a variety of voltage-sensitive components. It is
available in J-bend design (SMCJ) with the DO-214AB package for greater PC
board mounting density or in a Gull-wing design (SMCG) in the DO-215AB for
visible solder connections. Selections include unidirectional and bidirectional
as well as RoHS Compliant with an e3 suffix. They can protect from secondary
lightning effects per IEC61000-4-5 and class levels defined herein, or for
inductive switching environments and induced RF protection. Since their
response time is virtually instantaneous, they can also be used in protection
from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMC series are
equivalent to prior SMM package
identifications.
FEATURES
Economical surface mount design in both J-bend or
Gull-wing terminations
Available in both Unidirectional and Bidirectional
construction with a C or CA suffix
Optional 100%
screening for avionics grade
is
available by adding MA prefix to part number for added
100% temperature cycle -55
o
C to +125
o
C (10X) as well
as surge (3X) and 24 hours HTRB with post test V
BR
&
I
D
(in the operating direction for unidirectional or both
directions for bidirectional)
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are available by
adding MQ, MX, or MV prefixes respectively to part
numbers.
Axial-lead equivalent packages for thru-hole mounting
available as 1.5KE6.8 to 1.5KE200CA or 1N6267 thru
1N6303A and 1N5908 (consult factory for other
surface mount options)
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Selections for 5.0 to 170 volts standoff voltages (V
WM
)
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and
IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1: SMC 5.0 to SMC 170A or CA
Class 2: SMC 5.0 to SMC 150A or CA
Class 3: SMC 5.0 to SMC 75A or CA
Class 4: SMC 5.0 to SMC 36A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1 : SMC 5.0 to SMC 90A or CA
Class 2: SMC 5.0 to SMC 45A or CA
Class 3: SMC 5.0 to SMC 24A or CA
Class 4: SMC 5.0 to SMC 11A or CA
Secondary lightning protection per IEC61000-4-5 with
2 Ohms source impedance:
Class 2: SMC 5.0 to SMC 22A or CA
Class 3: SMC 5.0 to SMC 10A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 1500 watts at
10/1000
μs
(also see Fig 1,2, and 3)
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
º
º
Operating and Storage temperature: -65 C to +150 C
Thermal resistance: 20
º
C/W junction to lead, or 80
º
C/W
junction to ambient when mounted on FR4 PC board
(1oz Cu) with recommended footprint (see last page)
Steady-State Power dissipation: 6 watts at T
L
= 30
o
C,
or 1.56 watts at T
A
= 25
º
C when mounted on FR4 PC
board with recommended footprint
Forward Surge: 200 Amps peak impulse of 8.3 ms
half-sine wave at 25ºC (unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-bend)
leads, tin-lead or RoHS compliant annealed matte-tin
plating solderable to MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. No marking
on bi-directional devices
MARKING: Part number without “SM” prefix (e.g.
C5.0, C5.0A, C5.0CA, MXC5.0A, 5.0Ae3, C5.0CAe3,
C36, C36A, C36CA, MAC36CA, 36CAe3, etc.)
TAPE & REEL option: Standard per EIA-481-2 with
16 mm tape, 750 per 7 inch reel or 2500 per 13 inch
reel (add “TR” suffix to part number)
WEIGHT:
0.25 grams
SMC 5.0–170CA, e3
Copyright
©
2007
6-21-07 REV E
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
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