Revision 9
ProASIC3L Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
• Dramatic Reduction in Dynamic and Static Power Savings
• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power
• Low Power Consumption in Flash*Freeze Mode Allows for
Instantaneous Entry to / Exit from Low-Power Flash*Freeze
Mode
• Supports Single-Voltage System Operation
• Low-Impedance Switches
®
High Capacity
• 250,000 to 3,000,000 System Gates
• Up to 504 kbits of True Dual-Port SRAM
• Up to 620 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Live-at-Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II (A3PE3000L only)
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold-Sparing I/Os Programmable Output
Slew Rate and Drive Strength
• Programmable Input Delay (A3PE3000L only)
• Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC
®
3L Family
(except PQ208)
High Performance
• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System
Performance
• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit
PCI (1.2 V systems)
Clock Conditioning Circuit (CCC) and PLL
• Six CCC Blocks, One with Integrated PLL (ProASIC3L) and All
with Integrated PLL (ProASIC3EL)
• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
• Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V
systems) and 350 MHz (1.5 V systems))
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock
®
to Secure FPGA Contents
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• 24 SRAM and FIFO Configurations with Synchronous
Operation:
– 250 MHz: For 1.2 V systems
– 350 MHz: For 1.5 V systems
• ARM Cortex™-M1 Soft Processor Available with or without
Debug
A3P1000L
M1A3P1000L
1,000,000
24,576
144
32
1
Yes
1
18
4
300
A3PE3000L
M1A3PE3000L
3,000,000
75,264
504
112
1
Yes
6
18
8
620
PQ208
3
FG324, FG484, FG896
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
• High-Performance, Low-Skew Global Network
• Architecture Supports Ultra-High Utilization
Advanced and Pro (Professional) I/Os
• 700 Mbps DDR, LVDS-Capable I/Os
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 8 Banks per Chip
ARM
®
Processor Support in ProASIC3L FPGAs
Table 1 • ProASIC3 Low-Power Product Family
ProASIC3L Devices
A3P250L
A3P600L
ARM Cortex-M1 Devices
1
M1A3P600L
System Gates
250,000
600,000
VersaTiles (D-flip-flops)
6,144
13,824
RAM Kbits (1,024 bits)
36
108
4,608-Bit Blocks
8
24
FlashROM Kbits
1
1
2
Secure (AES) ISP
Yes
Yes
3
Integrated PLL in CCCs
1
1
VersaNet Globals
18
18
I/O Banks
4
4
Maximum User I/Os
157
235
Package Pins
VQFP
VQ100
PQFP
PQ208
PQ208
FBGA
FG144, FG256
FG144, FG256, FG484
Notes:
1. Refer to the
Cortex-M1
product brief for more information.
2. AES is not available for ARM Cortex-M1 ProASIC3L devices.
3. For the A3PE3000L, the PQ208 package has six CCCs and two PLLs.
PQ208
FG144, FG256, FG484
February 2009
© 2010 Actel Corporation
I
ProASIC3 nano Flash FPGAs
I/Os Per Package
1
ProASIC3L
Low-Power
Devices
ARM
Cortex-M1
Devices
A3P250L
2
A3P600L
A3P1000L
A3PE3000L
M1A3P600L
I/O Type
M1A3P1000L
M1A3PE3000L
3
Package
VQ100
PQ208
FG144
FG256
FG324
FG484
FG896
Single-
Ended I/O
4
68
151
97
157
–
–
–
Differential
I/O Pairs
13
34
24
38
–
–
–
Single-
Ended I/O
4
Differential
I/O Pairs
–
Single-
Ended I/O
4
–
154
97
177
–
300
–
Differential
I/O Pairs
–
35
25
44
–
74
–
Single-
Ended I/O
4
–
147
Differential
I/O Pairs
–
65
154
97
177
–
235
–
35
25
43
–
60
–
–
221
341
620
–
110
168
310
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the packaging section of the datasheet to
ensure you are complying with design and board migration requirements.
2. For A3P250L devices, the maximum number of LVPECL pairs in east and west banks cannot exceed 15.
3. ARM Cortex-M1 support is TBD on this device.
4. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
5. FG256 and FG484 are footprint-compatible packages.
6. "G" indicates RoHS-compliant packages. Refer to
"ProASIC3L Ordering Information" on page III
for the location of the "G" in the
part number.
7. For A3PE3000L devices, the usage of certain I/O standards is limited as follows:
– SSTL3(I) and (II): up to 40 I/Os per north or south bank
– LVPECL / GTL+ 3.3 V / GTL 3.3 V: up to 48 I/Os per north or south bank
– SSTL2(I) and (II) / GTL+ 2.5 V/ GTL 2.5 V: up to 72 I/Os per north or south bank
8. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not as a regular I/O, the number of single-ended
user I/Os available is reduced by one.
Table 2 • ProASIC3L FPGAs Package Sizes Dimensions
Package
Length × Width
(mm\mm)
Nominal Area
(mm
2
)
Pitch (mm)
Height (mm)
VQ100
14 × 14
196
0.5
1.00
PQ208
28 × 28
784
0.5
3.40
FG144
13 × 13
169
1.0
1.45
FG256
17 × 17
289
1.0
1.60
FG324
19 × 19
361
1.0
1.63
FG484
23 × 23
529
1.0
2.23
FG896
31 × 31
961
1.0
2.23
II
R ev i si o n 9
ProASIC3L Low Power Flash FPGAs
ProASIC3L Ordering Information
A3P1000L _
1
FG
G
144
I
Application (Temperature Range)
Blank = Commercial (0°C to +70°C Ambient Temperature)
I = Industrial (
–
40°C to +85°C Ambient Temperature)
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G= RoHS-Compliant (Green) Packaging
Package Type
VQ = Very Thin Quad Flat Pack (0.5 mm pitch)
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Speed Grade
Blank = Standard
1 = 15% Faster than Standard
Part Number
ProASIC3L Devices
A3P250L = 250,000 System Gates
A3P600L = 600,000 System Gates
A3P1000L = 1,000,000 System Gates
A3PE3000L = 3,000,000 System Gates
ProASIC3L Devices with Cortex-M1
M1A3P600L = 600,000 System Gates
M1A3P1000L = 1,000,000 System Gates
M1A3PE3000L = 3,000,000 System Gates
ProASIC3L Device Status
ProASIC3L Devices
A3P250L
A3P600L
A3P1000L
A3PE3000L
Status
Advance
Advance
Advance
Advance
M1A3P600L
M1A3P1000L
M1A3PE3000L
Advance
Advance
Advance
ARM Cortex-M1 Devices
Status
R e visi on 9
III
ProASIC3 nano Flash FPGAs
Temperature Grade Offerings
Package
ARM Cortex-M1 Devices
VQ100
PQ208
FG144
FG256
FG324
FG484
FG896
C, I
C, I
C, I
C, I
–
–
–
A3P250L
A3P600L
M1A3P600L
–
C, I
C, I
C, I
–
C, I
–
A3P1000L
M1A3P1000L
–
C, I
C, I
C, I
–
C, I
–
C, I
C, I
C, I
C, I
A3PE3000L
M1A3PE3000L
Notes:
1. C = Commercial temperature range: 0°C to 70°C ambient temperature.
2. I = Industrial temperature range: –40°C to 85°C ambient temperature.
Speed Grade and Temperature Grade Matrix
Temperature Grade
C
1
I
2
Std.
–1
✓
✓
✓
✓
Notes:
1. C = Commercial temperature range: 0°C to 70°C ambient temperature.
2. I = Industrial temperature range: –40°C to 85°C ambient temperature.
http://www.actel.com/contact/default.aspx.
IV
R ev i si o n 9
ProASIC3L Low Power Flash FPGAs
Table of Contents
ProASIC3L Device Family Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
ProASIC3L DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-115
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-121
Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-126
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-128
Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-143
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-144
Package Pin Assignments
100-Pin VQFP
208-Pin PQFP
144-Pin FBGA
256-Pin FBGA
324-Pin FBGA
484-Pin FBGA
896-Pin FBGA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-50
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Revision 9
V
GD32 MCU
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