ADC, Successive Approximation, 8-Bit, 1 Func, 2 Channel, Parallel, 8 Bits Access, CMOS, PQCC20, PLASTIC, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | QCCJ, LDCC20,.4SQ |
针数 | 20 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
Is Samacsys | N |
最大模拟输入电压 | 5.1 V |
最小模拟输入电压 | -0.1 V |
最长转换时间 | 850 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-PQCC-J20 |
JESD-609代码 | e0 |
长度 | 8.965 mm |
最大线性误差 (EL) | 0.39% |
模拟输入通道数量 | 2 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | BINARY |
输出格式 | PARALLEL, 8 BITS |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC20,.4SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
认证状态 | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 4.57 mm |
最大压摆率 | 3 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 8.965 mm |
Base Number Matches | 1 |
ML2252CCQ | ML2252CCP | ML2252BCP | ML2259BCQ | ML2259CCQ | |
---|---|---|---|---|---|
描述 | ADC, Successive Approximation, 8-Bit, 1 Func, 2 Channel, Parallel, 8 Bits Access, CMOS, PQCC20, PLASTIC, LCC-20 | ADC, Successive Approximation, 8-Bit, 1 Func, 2 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20 | ADC, Successive Approximation, 8-Bit, 1 Func, 2 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20 | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, PQCC28, PLASTIC, LCC-28 | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, PQCC28, PLASTIC, LCC-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QLCC | DIP | DIP | QLCC | QLCC |
包装说明 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCJ, LDCC28,.5SQ | PLASTIC, LCC-28 |
针数 | 20 | 20 | 20 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V |
最小模拟输入电压 | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V |
最长转换时间 | 850 µs | 850 µs | 850 µs | 850 µs | 850 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | S-PQCC-J20 | R-PDIP-T20 | R-PDIP-T20 | S-PQCC-J28 | S-PQCC-J28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
长度 | 8.965 mm | 25.97 mm | 25.97 mm | 11.505 mm | 11.505 mm |
最大线性误差 (EL) | 0.39% | 0.39% | 0.195% | 0.195% | 0.39% |
模拟输入通道数量 | 2 | 2 | 2 | 8 | 8 |
位数 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 28 | 28 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY |
输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | DIP | QCCJ | QCCJ |
封装等效代码 | LDCC20,.4SQ | DIP20,.3 | DIP20,.3 | LDCC28,.5SQ | LDCC28,.5SQ |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 4.57 mm | 4.32 mm | 4.32 mm | 4.57 mm | 4.57 mm |
最大压摆率 | 3 mA | 3 mA | 3 mA | 3 mA | 3 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | QUAD | QUAD |
宽度 | 8.965 mm | 7.62 mm | 7.62 mm | 11.505 mm | 11.505 mm |
Is Samacsys | N | N | N | - | - |
Base Number Matches | 1 | 1 | 1 | - | - |
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