Chip Schottky Barrier Rectifier
Formosa MS
FM0540-MH1 THRU FM05100-MH1
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 1
DS-12164L
Chip Schottky Barrier Rectifier
Formosa MS
Package outline
SOD-123H1
0.146(3.7)
0.130(3.3)
FM0540-MH1 THRU FM05100-MH1
0.5A Surface Mount
Schottky Barrier Rectifiers - 40V-100V
Features
•
Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Tiny plastic SMD package.
Low power loss, high efficiency.
High current capability, low forward voltage drop.
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen free parts, ex. FM0540-MΗ1-H.
0.071(1.8)
0.056(1.4)
0.012(0.3) Typ.
0.004(0.1) Typ.
Mechanical data
•
•
•
•
•
•
Epoxy : UL94-V0 rated flame retardant
0.031(0.8) Typ.
0.040(1.0)
0.024(0.6)
Case : Molded plastic, SOD-123H1
Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : Approximated 0.0103 gram
Dimensions in inches and (millimeters)
0.031(0.8) Typ.
Maximum ratings and Electrical Characteristics
(AT
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3ms single half sine-wave
(JEDEC
Method)
Maximum instantaneous forward voltage at I
F
=0.5A
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance
(Note
1)
Operating junction temperature range
Storage temperature range
T
J
=25
°C
T
J
=100°C
T
A
=25
o
C unless otherwise noted)
SYMBOLS
FM0540-MH1 FM0560-MH1 FM05100-MH1
UNITS
V
RRM
V
RMS
V
DC
I
O
I
FSM
V
F
I
R
C
J
T
J
T
STG
-55
to
+125
40
28
40
60
42
60
0.5
15
100
70
100
Volts
Volts
Volts
Amps
Amps
Volts
mA
pF
°C
°C
0.50
0.65
0.5
10
120
-55
to
+150
-55
to
+150
0.80
Notes 1: Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 2
DS-12164L
Rating and characteristic curves (FM0540-MH1 THRU FM05100-MH1)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
FIG.2-TYPICAL FORWARD
CHARACTERISTICS
0.6
0.5
50
INSTANTANEOUS FORWARD CURRENT,(A)
FM
FM
0.4
05
05
60
0.3
0.2
0.1
0
0
20
40
60
80
10
3.0
1.0
40
V
60
V
10
0V
H1
-M
100
LEAD TEMPERATURE,( C)
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
15
40
-M
H1
~F
M0
51
00
-M
H1
120
140
160
180
200
T
J
=25 C
Pulse Width 300us
1% Duty Cycle
0.1
PEAK FORWARD SURGE CURRENT,(A)
12
.01
.1
.3
.5
.7
.9
1.1
1.3
1.5
9
T
J
=25 C
8.3ms Single Half
Sine Wave
JEDEC method
FORWARD VOLTAGE,(V)
6
3
FIG.5 - TYPICAL REVERSE
0
1
5
10
50
100
CHARACTERISTICS
100
NUMBER OF CYCLES AT 60Hz
FIG.4-TYPICAL JUNCTION CAPACITANCE
350
300
250
200
150
100
50
0
JUNCTION CAPACITANCE,(pF)
REVERSE LEAKAGE CURRENT, (mA)
10
1.0
T
J
=75 C
.1
T
J
=25 C
.01
.05
.1
.5
1
5
10
50
100
.01
0
20
40
60
80
100 120 140
REVERSE VOLTAGE,(V)
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 3
DS-12164L
Chip Schottky Barrier Rectifier
Formosa MS
Simplified outline
Symbol
FM0540-MH1 THRU FM05100-MH1
Pinning information
Pin
Pin1
Pin2
cathode
anode
1
2
1
2
Marking
Type number
FM0540-MH1
FM0560-MH1
FM05100-MH1
Marking code
04
06
01
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
SOD-123H1
A
0.071 (1.80)
B
0.051 (1.30)
C
0.067 (1.70)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 4
DS-12164L
Chip Schottky Barrier Rectifier
Formosa MS
P
1
FM0540-MH1 THRU FM05100-MH1
Packing information
P
0
d
E
F
B
W
A
P
D
2
T
C
D
W
1
D
1
unit:mm
Item
Symbol
Tolerance
SOD-123H1
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
-
-
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2013/12/17
Revised Date
-
Revision
A
Page.
7
Page 5
DS-12164L
嵌入式系统
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