FEATURES AND SPECIFICATIONS
Features and Benefits
15A per blade current carrying capacity
Female on backplane for safety
3 mating lengths for live insertion
12mm module can be distributed between signal modules
as needed
s
Integral stiffener combines signal, power and guidance
modules
s
Metric connector in Futurebus form factor
s
Surface Mount Compatible
s
s
s
s
Electrical
Current: 15.0A
Dielectric Withstanding Voltage: 1000V
Insulation Resistance: 1000 M
Ω
min.
Mechanical
Insertion Force: 55N max. per press-fit pin
Retention Force: 15N min. per press-fit pin
Mating Force: 2.5N max. per contact
Unmating Force: 0.15N min.
Normal Force: 1.0N min.
Durability: 250 cycles
Physical
Housing: Liquid crystal polymer
Contact: Blades—0.5mm thick Copper
Receptacle—0.4mm Beryllium Copper Alloy
Plating: 30
µ
" Gold
Operating Temperature: -55 to +105˚C
2.00mm (.079") Pitch
HDM*
Board-to-Board
Daughterboard Power Module
73651
Right Angle
3-Blade Module
Backplane Connector Systems
Reference Information
Product Specification: PS-73651-1998
Packaging: Tube
UL File No.: E29179
Mates With:
73656
Designed In: Millimeters
CATALOG DRAWING (FOR REFERENCE ONLY)
J
0.71
DIA plated thru hole TYP
.028
0.838
DIA drilled hole
0.0330
Note: Solder tail version shown
ORDERING INFORMATION AND DIMENSIONS
Module
Termination
Solder Tail
Solder Tail
Solder Tail
Solder Tail
Solder Tail
Solder Tail
Press-Fit
Order No.
73651-0033
73651-0133
73651-0233
73651-0333
73651-0433
73651-0XXX
73651-1XXX
Dimension P
2.00 (.079)
2.50 (.098)
3.00 (.118)
3.50 (.138)
4.00 (.157)
Contact Molex
3.50 (.138)
Application Note: Connectors are Ordered as Part of an Assembly, Not Individually
Daughter Card
Power Module
The HDM and HDM
PLUS
daughtercard connectors are composed of modules. The complete
connector with a number of modules, stiffener and hold-downs is given a specific part number
so that a user only needs to order one connector. We show the individual modules in this
catalog, but they are always delivered as completed connectors on a stiffener. On the customer
print for the stiffener is the complete PCB footprint showing holes for signal and power
contacts, plus appropriate mounting holddown features. Most customers use solder-to-board
versions of the RA receptacles, but press-fit RA receptacles are an option.
* High Density Metric and HDM
PLUS
are trademarks of Teradyne, Inc.
Note: The versions listed here have 3 mating levels: M1-short, M2-medium and M3-long, please contact Molex for
more information
MX01
J-31
微控制器 MCU
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