电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

GT28F128W18B70

产品描述Flash, 8MX16, 70ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56
产品类别存储    存储   
文件大小598KB,共86页
制造商Numonyx ( Micron )
官网地址https://www.micron.com
下载文档 详细参数 选型对比 全文预览

GT28F128W18B70概述

Flash, 8MX16, 70ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56

GT28F128W18B70规格参数

参数名称属性值
零件包装代码BGA
包装说明VFBGA,
针数56
Reach Compliance Codeunknown
ECCN代码3A991.B.1.A
Is SamacsysN
最长访问时间70 ns
其他特性ALSO SUPPORTS SYNCHRONOUS OPERATION
启动块BOTTOM
JESD-30 代码R-PBGA-B56
长度9 mm
内存密度134217728 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
端子数量56
字数8388608 words
字数代码8000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织8MX16
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行PARALLEL
编程电压1.8 V
认证状态Not Qualified
座面最大高度1 mm
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距0.75 mm
端子位置BOTTOM
类型NOR TYPE
宽度7.7 mm
Base Number Matches1

文档预览

下载PDF文档
1.8 Volt Intel
®
Wireless Flash Memory
(W18)
28F320W18, 28F640W18, 28F128W18
Preliminary Datasheet
Product Features
High Performance
— 70 ns Initial Access Speed
— 14 ns Clock to Data Output Zero Wait-State
Synchronous Burst Mode
— 20 ns Page Mode Read Speed
— 4-, 8-, and Continuous Word Burst Modes
— Burst and Page Modes in Both Parameter and
Main Partitions
— Programmable WAIT Configuration
— Enhanced Factory Programming Mode:
3.50 µs/Word (Typ)
— Glueless 12 V interface for Fast Factory
Programming @ 8 µs/Word (Typ)
— 1.8 V Low-Power Programming @ 12 µs/Word
(Typ)
— Program or Erase during Reads
s
Architecture
— Multiple 4-Mbit Partitions
— Dual-Operation: RWW or RWE (Read-While -
Write or Read-While-Erase)
— Eight, 4-Kword Parameter Code/Data Blocks
— 32-Kword Main Code/Data Blocks
— Top and Bottom Parameter Configurations
s
Power Operation
— 1.65 V to 1.95 V Read and Write Operations
— 1.7 V to 2.24 V V
CCQ
for I/O Isolation
— Standby Current: 5 µA (Typ)
— 40/52/66 MHz 4-word Sync Read
Current: 7 mA (Typ)
s
Software
— 5 µs (Typ) Program Suspend
— 5 µs (Typ) Erase Suspend
— Intel
®
Flash Data Integrator (IFDI) Software
Optimized
— Intel Basic Command Set Compatible
— Common Flash Interface (CFI)
s
Quality and Reliability
— Extended Temperature –40 °C to +85 °C
— Minimum 100K Block Erase Cycles
— ETOX™ VII Flash Technology (0.18 µm)
s
Security
— Two 64-bit Protection Registers: 64 Unique
Device Identifier Bits; 64 User-Programmable
OTP Bits
— Absolute Write Protection
⇒V
PP
= GND
— Erase/Program Lockout during Power
Transitions
— Individual Dynamic Zero-Latency Block
Locking
s
Density and Packaging
— 32-Mbit in a VF BGA Package
— 64-Mbit and 128-Mbit in
µBGA*Package
— 56 Active Ball Matrix, 0.75 mm Ball-Pitch
µBGA*
and VF BGA Packages
— 16-Bit Wide Data Bus
s
The 1.8 Volt Intel
®
Wireless Flash memory with flexible multi-partition dual-operation provides high-
performance asynchronous and synchronous burst reads. It is an ideal memory for low-voltage burst CPUs.
Combining high read performance with flash memory’s intrinsic non-volatility, 1.8 Volt Intel
®
Wireless Flash
memory eliminates the traditional system-performance paradigm of shadowing redundant code memory from
slow nonvolatile storage to faster execution memory. It reduces the total memory requirement that increases
reliability and reduces overall system power consumption and cost.
The 1.8 Volt Intel
®
Wireless Flash memory’s flexible multi-partition architecture allows programming or erasing
to occur in one partition while reading from another partition. This allows for higher data write throughput
compared to single partition architectures. The dual-operation architecture also allows two processors to
interleave code operations while program and erase operations take place in the background. The designer can
also choose the size of the code and data partitions via the flexible multi-partition architecture.
The 1.8 Volt Intel
®
Wireless Flash memory is manufactured on Intel
®
0.18 µm ETOX™ VII process technology.
It is available in µBGA and VF BGA packages, which are ideal for board-constrained applications.
Notice:
This document contains preliminary information on new products in production. The
specifications are subject to change without notice. Verify with your local Intel sales office that
you have the latest datasheet before finalizing a design.
Order Number:
290701-002
January 2001

GT28F128W18B70相似产品对比

GT28F128W18B70 GT28F128W18T85 GT28F128W18B85 GT28F128W18T70
描述 Flash, 8MX16, 70ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56 Flash, 8MX16, 85ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56 Flash, 8MX16, 85ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56 Flash, 8MX16, 70ns, PBGA56, 0.75 MM PITCH, CSP, MICRO, BGA-56
零件包装代码 BGA BGA BGA BGA
包装说明 VFBGA, 0.75 MM PITCH, CSP, MICRO, BGA-56 0.75 MM PITCH, CSP, MICRO, BGA-56 0.75 MM PITCH, CSP, MICRO, BGA-56
针数 56 56 56 56
Reach Compliance Code unknown unknow unknow unknown
ECCN代码 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 70 ns 85 ns 85 ns 70 ns
其他特性 ALSO SUPPORTS SYNCHRONOUS OPERATION ALSO SUPPORTS SYNCHRONOUS OPERATION ALSO SUPPORTS SYNCHRONOUS OPERATION ALSO SUPPORTS SYNCHRONOUS OPERATION
启动块 BOTTOM TOP BOTTOM TOP
JESD-30 代码 R-PBGA-B56 R-PBGA-B56 R-PBGA-B56 R-PBGA-B56
长度 9 mm 9 mm 9 mm 9 mm
内存密度 134217728 bit 134217728 bi 134217728 bi 134217728 bit
内存集成电路类型 FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16
功能数量 1 1 1 1
端子数量 56 56 56 56
字数 8388608 words 8388608 words 8388608 words 8388608 words
字数代码 8000000 8000000 8000000 8000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
组织 8MX16 8MX16 8MX16 8MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA VFBGA VFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 1.8 V 1.8 V 1.8 V 1.8 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 1 mm 1 mm 1 mm
最大供电电压 (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL BALL BALL
端子节距 0.75 mm 0.75 mm 0.75 mm 0.75 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 7.7 mm 7.7 mm 7.7 mm 7.7 mm
Base Number Matches 1 1 1 1
讨论一下:大家平时做ppt的时候,模板都是自己做还是从网上下载呢
讨论一下:大家平时做ppt的时候,模板都是自己做还是从网上下载呢,有没有好的模板下载网址下载(免费的最好,现在感觉一个好点的模板都要好几十) ...
xxhhzz 聊聊、笑笑、闹闹
TI积分兑换E金币,未到账
请问是否有工作人员在跟进处理呢?已经兑换很久了,至今未到账。 TI签到积分兑换礼品是否还有效?请工作人员告知,否则大家就不用浪费时间。 ...
SensorYoung 聊聊、笑笑、闹闹
有个问题,能帮我解决的现金酬谢
有哪位兄台知道如果利用AT命令控制短信猫设备拨打USSD号码:如:*111*222×NNN#这样的号码。 如果有成功实现过的请和我联系。QQ:61238333.如果能帮我解决问题。现金200元酬谢。...
weiyt 嵌入式系统
提高验证效率的验证计划改善方法
项目管理的内容不外乎计划和执行,如果每个人都对其验证项目进行了良好的计划,那么为什么还会存在质量问题和进度落后的情况?一份优秀的计划中应包含用可度量指标描述的详细目标、最佳的资源利 ......
tmily 无线连接
7款 ADI 最新超低噪声 MEMS加速度计,据说可上天入地~~~
ADXL354 / 355 超低噪声,高稳定性,三轴低噪声加速度计(>>点击查看更多)   ADXL355 和 ADXL354 能以极低的噪声执行高分辨率振动测量,可通过无线传感器网络实现结构缺陷的早期检测,如铁 ......
soso ADI 工业技术
keil4的头文件有点迷糊~
#include "inc/hw_ints.h"和#include "hw_ints.h"有什么区别吗?为什么我的Keil的头文件里有#include "inc/hw_ints.h"但是在文件里没有找到#include "inc/hw_ints.h"。只有#include "hw_ints.h" ......
bajie_zhl19 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1968  966  130  1955  1105  43  22  29  53  3 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved