HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | not_compliant |
Is Samacsys | N |
其他特性 | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
系列 | HC/UH |
JESD-30 代码 | S-CQCC-N20 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D LATCH |
最大I(ol) | 0.0052 A |
位数 | 1 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2/6 V |
Prop。Delay @ Nom-Sup | 39 ns |
传播延迟(tpd) | 195 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.03 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | LOW LEVEL |
宽度 | 8.89 mm |
Base Number Matches | 1 |
SN54HC259FK | SN54HC259FK-00 | SN54HC259FKR | SN74HC259D-00 | SN74HC259DR-00 | SN74HC259N-00 | SN74HC259N-10 | SN54HC259J-00 | SN54HC259WR | SN74HC259PWLE | |
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描述 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CQCC20 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDSO16 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDSO16 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDIP16 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDIP16 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CDIP16 | HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | 8-Bit Addressable Latches 16-TSSOP -40 to 85 |
包装说明 | QCCN, LCC20,.35SQ | QCCN, | QCCN, | SOP, | SOP, | DIP, | DIP, | DIP, | DFP, | TSSOP, TSSOP16,.25 |
Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | not_compliant |
其他特性 | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH | 1:8 DMUX FOLLOWED BY LATCH |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-GDFP-F16 | R-PDSO-G16 |
长度 | 8.89 mm | 8.89 mm | 8.89 mm | 9.9 mm | 9.9 mm | 19.305 mm | 19.305 mm | 19.56 mm | 10.2 mm | 5 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | QCCN | QCCN | QCCN | SOP | SOP | DIP | DIP | DIP | DFP | TSSOP |
封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 195 ns | 51 ns | 195 ns | 43 ns | 43 ns | 43 ns | 43 ns | 51 ns | 195 ns | 165 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.03 mm | 2.03 mm | 2.03 mm | 1.75 mm | 1.75 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.03 mm | 1.2 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | NO | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
触发器类型 | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
宽度 | 8.89 mm | 8.89 mm | 8.89 mm | 3.9 mm | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 6.73 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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