4000/14000/40000 SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, CERDIP-14
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | AND GATE |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5/15 V |
| 传播延迟（tpd） | 250 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 15 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| CD4073BCJ | CD4075BCJ | CD4075BMN | CD4073BMN | |
|---|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, CERDIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, CDIP14, CERDIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT OR GATE, PDIP14, PLASTIC, DIP-14 | 4000/14000/40000 SERIES, TRIPLE 3-INPUT AND GATE, PDIP14, PLASTIC, DIP-14 |
| 零件包装代码 | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, | DIP, |
| 针数 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
| 长度 | 19.43 mm | 19.43 mm | 19.215 mm | 19.215 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND GATE | OR GATE | OR GATE | AND GATE |
| 功能数量 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 250 ns | 250 ns | 250 ns | 250 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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