CD74AC7060EX
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| 计数方向 | UP |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 负载/预设输入 | NO |
| 逻辑集成电路类型 | BINARY COUNTER |
| 最大频率@ Nom-Sup | 71000000 Hz |
| 最大I（ol） | 0.024 A |
| 工作模式 | ASYNCHRONOUS |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3.3/5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| CD74AC7060EX | CD54AC7061E | CD74ACT7060EX | CD74ACT7060M96 | CD74ACT7061M96 | CD74AC7060M96 | CD74AC7061M96 | |
|---|---|---|---|---|---|---|---|
| 描述 | CD74AC7060EX | CD54AC7061E | CD74ACT7060EX | CD74ACT7060M96 | CD74ACT7061M96 | CD74AC7060M96 | CD74AC7061M96 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| 计数方向 | UP | UP | UP | UP | UP | UP | UP |
| JESD-30 代码 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 负载/预设输入 | NO | NO | NO | NO | NO | NO | NO |
| 逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | SOP | SOP | SOP | SOP |
| 封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 | SOP20,.4 | SOP20,.4 | SOP20,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 表面贴装 | NO | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最大频率@ Nom-Sup | 71000000 Hz | 71000000 Hz | 100000000 Hz | 100000000 Hz | 100000000 Hz | 71000000 Hz | - |
| 电源 | 3.3/5 V | 3.3/5 V | - | - | 5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 厂商名称 | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 包装方法 | - | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
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