Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> HD6472357TE20

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HD6472357TE20: 产品描述IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,TQFP,120PIN,PLASTIC; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小4MB，共1047页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HD6472357TE20概述

IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,TQFP,120PIN,PLASTIC

HD6472357TE20规格参数

参数名称	属性值
是否Rohs认证	不符合
包装说明	QFP, TQFP120,.64SQ,16
Reach Compliance Code	unknown
Is Samacsys	N
具有ADC	YES
地址总线宽度	24
位大小	16
CPU系列	H8S/2000
DMA 通道	YES
外部数据总线宽度	16
JESD-30 代码	S-PQFP-G120
长度	14 mm
I/O 线路数量	87
端子数量	120
最高工作温度	70 °C
最低工作温度	-20 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	QFP
封装等效代码	TQFP120,.64SQ,16
封装形状	SQUARE
封装形式	FLATPACK
电源	5 V
认证状态	Not Qualified
RAM（字节）	8192
ROM（单词）	131072
ROM可编程性	UVPROM
速度	20 MHz
最大压摆率	69 mA
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	0.4 mm
端子位置	QUAD
宽度	14 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER
Base Number Matches	1

文档解析

这份文档是关于Renesas 16-Bit单片微型计算机H8S系列的硬件手册，涵盖了H8S/2357组，特别是H8S/2357F-ZTATM和H8S/2398F-ZTATTM型号。以下是一些值得关注的技术信息：

产品修订信息：文档提供了关于H8S/2357组硬件的修订列表，包括新增内容和产品系列的更新。
法律声明和免责声明：文档明确了材料的使用条款，包括版权、责任限制和产品数据的使用。
产品选择指南：提供了关于如何根据客户需求选择合适的Renesas Technology Corp.产品的指导。
技术规格和特性：详细介绍了H8S/2357组的CPU核心、内部存储器、总线控制器、数据传输控制器、定时器、串行通信接口、D/A转换器、A/D转换器和I/O端口等特性。
硬件功能和电气特性：深入解释了H8S/2357组的硬件功能和电气特性，包括CPU操作模式、地址空间、寄存器配置、指令集、异常处理、中断控制器、DMA控制器、I/O端口等。
应用指南：为设计者提供了关于如何使用H8S/2357组设计应用系统的指南。
开发工具用户手册：提供了与H8S系列相关的C/C++编译器、汇编器、优化链接器、模拟器/调试器和高性能嵌入式工作坊的用户手册。
技术问答：提供了H8S家族技术问题和答案的手册。
主要修订：列出了本版手册的主要修订内容，包括产品阵容的更新、异常向量表的描述修订、DRAM访问时序图的修订等。
安全注意事项：强调了在设计电路时考虑安全性的重要性，包括对NC引脚、未使用的输入引脚、初始化前的处理和未定义或保留地址的访问。
产品代码系列：提供了不同型号的产品代码和封装类型。
封装尺寸：提供了TFP-120和FP-128B封装的尺寸图。
指令集：附录中包含了H8S/2357组的指令集列表、指令代码、操作码映射、指令执行所需的状态数、指令执行期间的总线状态和条件码修改。
内部I/O寄存器：提供了内部I/O寄存器的地址和功能。
I/O端口块图：展示了不同端口的块图。
引脚状态：提供了不同模式下引脚的状态，包括电源开启时引脚的状态。
硬件待机模式的过渡和恢复时间：提供了过渡到和从硬件待机模式恢复的时间。
产品代码系列：列出了产品的不同代码和版本。
封装尺寸：提供了不同封装的尺寸信息。
电气特性：详细描述了不同版本产品的电气特性，包括绝对最大额定值、直流特性、交流特性、A/D转换特性、D/A转换特性等。

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REJ09B0138-0600H

The revision list can be viewed directly by clicking the title page.

The revision list summarizes the locations of revisions and additions.

Details should always be checked by referring to the relevant text.

H8S/2357 Group, H8S/2357F-ZTAT

H8S/2398F-ZTAT

Hardware Manual

Renesas 16-Bit Single-chip Microcomputer

H8S Family / H8S/2300 Series

Rev. 6.00

Revision date: Oct. 28, 2004

www.renesas.com

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and

more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corp. product best suited to the customer's application; they do not convey any license

under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or

a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-

party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corp. without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or

an authorized Renesas Technology Corp. product distributor for the latest product information before

purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising

from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various means,

including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data,

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total

system before making a final decision on the applicability of the information and products. Renesas

Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or

system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when

considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must

be exported under a license from the Japanese government and cannot be imported into a country

other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products

contained therein.

Preface

This LSI is a single-chip microcomputer with a 32-bit H8S/2000 CPU core, and a set of on-chip peripheral functions

required for system configuration.

This LSI is equipped with ROM, RAM, a bus controller, a data transfer controller (DTC), a programmable pulse generator

(PPG), three types of timers, a serial communication interface (SCI), a D/A converter, an A/D converter, and I/O ports as

on-chip peripheral functions. This LSI is suitable for use as an embedded microcomputer for high-level control systems.

Its on-chip ROM is flash memory (F-ZTAT

*), PROM (ZTAT

*), or masked ROM that provides flexibility as it can be

reprogrammed in no time to cope with all situations from the early stages of mass production to full-scale mass

production. This is particularly applicable to application devices with specifications that will most probably change.

Note: * F-ZTAT is a trademark of Renesas Technology, Corp.

ZTAT is a registered trademark of Renesas Technology, Corp.

Target Users: This manual was written for users who will be using the H8S/2357 Group in the design of application

systems. Members of this audience are expected to understand the fundamentals of electrical circuits,

logical circuits, and microcomputers.

Objective:

This manual was written to explain the hardware functions and electrical characteristics of the H8S/2357

Group to the above audience.

Refer to the H8S/2600 Series, H8S/2000 Series Programming Manual for a detailed description of the

instruction set.

Notes on reading this manual:

•

In order to understand the overall functions of the chip

Read the manual according to the contents. This manual can be roughly categorized into parts on the CPU, system

control functions, peripheral functions, and electrical characteristics.

•

In order to understand the details of the CPU's functions

Read the H8S/2600 Series, H8S/2000 Series Programming Manual.

•

In order to understand the details of a register when its name is known

The addresses, bits, and initial values of the registers are summarized in Appendix B, Internal I/O Register.

Examples:

Related Manuals:

Bit order:

The MSB is on the left and the LSB is on the right.

The latest versions of all related manuals are available from our web site. Please ensure you have the

latest versions of all documents you require.

http://www.renesas.com/eng/

H8S/2357 Group user's manuals:

Manual Title

H8S/2357 Group Hardware Manual

H8S/2600 Series, H8S/2000 Series Programming Manual

Document No.

This manual

REJ09B0139

Rev.6.00 Oct.28.2004 page i of xxiv

REJ09B0138-0600H

HD6472357TE20相似产品对比

	HD6472357TE20	HD64F2398F20TV	HD6412352TE10V	HD6432357(AXX)FV	HD6412352F13V	HD6472357TE20V	HD6432357(KXX)F	HD6432357(AXX)F	HD6432398(AXX)TEV
描述	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,TQFP,120PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,QFP,128PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,TQFP,120PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,QFP,128PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,QFP,128PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,TQFP,120PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,QFP,128PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,QFP,128PIN,PLASTIC	IC,MICROCONTROLLER,16-BIT,H8S/2000 CPU,CMOS,TQFP,120PIN,PLASTIC
是否Rohs认证	不符合	符合	符合	符合	符合	符合	不符合	不符合	符合
Reach Compliance Code	unknown	unknown	unknown	compliant	compliant	unknown	unknown	unknown	compliant
位大小	16	16	16	16	16	16	16	16	16
CPU系列	H8S/2000	H8S/2000	H8S/2000	H8S/2000	H8S/2000	H8S/2000	H8S/2000	H8S/2000	H8S/2000
JESD-30 代码	S-PQFP-G120	R-PQFP-G128	S-PQFP-G120	R-PQFP-G128	R-PQFP-G128	S-PQFP-G120	R-PQFP-G128	R-PQFP-G128	S-PQFP-G120
端子数量	120	128	120	128	128	120	128	128	120
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
最低工作温度	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
封装等效代码	TQFP120,.64SQ,16	QFP128,.63X.87,20	TQFP120,.64SQ,16	QFP128,.63X.87,20	QFP128,.63X.87,20	TQFP120,.64SQ,16	QFP128,.63X.87,20	QFP128,.63X.87,20	TQFP120,.64SQ,16
封装形状	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
电源	5 V	5 V	3/5 V	5 V	3.3/5 V	5 V	3/5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	8192	8192	8192	8192	8192	8192	8192	8192	8192
ROM（单词）	131072	262144	-	131072	-	131072	131072	131072	262144
速度	20 MHz	20 MHz	10 MHz	20 MHz	13 MHz	20 MHz	10 MHz	20 MHz	20 MHz
最大压摆率	69 mA	69 mA	69 mA	69 mA	69 mA	69 mA	69 mA	69 mA	69 mA
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.4 mm	0.5 mm	0.4 mm	0.5 mm	0.5 mm	0.4 mm	0.5 mm	0.5 mm	0.4 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
包装说明	QFP, TQFP120,.64SQ,16	QFP, QFP128,.63X.87,20	QFP, TQFP120,.64SQ,16	-	QFP, QFP128,.63X.87,20	QFP, TQFP120,.64SQ,16	QFP, QFP128,.63X.87,20	-	-
ROM可编程性	UVPROM	FLASH	-	MROM	-	UVPROM	MROM	MROM	MROM
标称供电电压	5 V	5 V	-	5 V	-	5 V	3 V	5 V	5 V
Base Number Matches	1	1	1	1	1	1	1	-	-
厂商名称	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	-	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)

HD6472357TE20

HD6472357TE20概述

HD6472357TE20规格参数

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