Freescale Semiconductor, Inc.
Order Number: XPC750EC/D
Rev 1, 10/06/1999
Semiconductor Products Sector
ª
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Advance Information
XPC750P RISC Microprocessor
Hardware SpeciÞcations
This document describes pertinent physical characteristics of the XPC750P, a process-remapped version of
the MPC750. This part has been previously described jointly with the MPC750 in the MPC750 RISC
Microprocessor Hardware SpeciÞcations (MPC750EC/D Rev 1); however, it is now being described
separately because the MPC750 is available over much wider operating conditions (including extended
temperature conditions). The XPC750P described herein will only be available at the restricted operating
conditions described in Table 3..
This document describes the XPC750P, however, unless otherwise noted, all information here applies also
to the XPC740P. The XPC750P and XPC740P are implementations of the PowerPCª family of reduced
instruction set computing (RISC) microprocessors. For functional characteristics of the processor, refer to
the
MPC750 RISC Microprocessor UserÕs Manual
.
The MPC750 family has been implemented in several semiconductor fabrication processes. Different
processes require different supply voltages and may have other electrical differences. The implementations
are, in general, functionally equivalent but may represent different revisions of the design with regard to
errata. A companion document, called a Part Number SpeciÞcation, is created to describe errata or
speciÞcation variances that are unique to a particular revision. Part Number SpeciÞcations, if applicable, are
available at the same website, http://www.mot.com/PowerPC, where this document is found.
This document contains information on a new product under development by Motorola.
Motorola reserves the right to change or discontinue this product without notice.
© Motorola, Inc., 1999. All rights reserved.
PRELIMINARYÑSUBJECT TO CHANGE WITHOUT NOTICE
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As a designator to distinguish between MPC750 implementations in various processes, a sufÞx is added to
the MPC750 part number as shown in Table 1.
Table 1. MPC750 Microprocessors from Motorola
Part Number
MPC750A, MPC740A
XPC750P, XPC740P
Process
0.29 µm CMOS, 5LM
0.19 µm CMOS, 5LM
Core
Voltage
2.6 V
1.9 V
I/O
Voltage
3.3 V
3.3 V
5-Volt
Tolerant
No
No
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This document will describe only the XPC750P implementation with its unique supply voltages, package
(decoupling capacitors are added on the package), and unique AC timing speciÞcations. Major subsections
of this document which are identical to the MPC750 Hardware SpeciÞcation are not repeated here to reduce
confusion. Please refer to the MPC750 document for those unchanged subsections.
This document contains the following topics:
Topic
Page
Section 1.1, ÒOverviewÓ
Section 1.2, ÒFeaturesÓ
Section 1.3, ÒGeneral ParametersÓ
Section 1.4, ÒElectrical and Thermal CharacteristicsÓ
Section 1.4.1, ÒDC Electrical CharacteristicsÓ
Section 1.4.2, ÒAC Electrical CharacteristicsÓ
Section 1.4.2.1, ÒClock AC SpeciÞcationsÓ
Section 1.4.2.2, Ò60x Bus Input AC SpeciÞcationsÓ
Section 1.4.2.3, Ò60x Bus Output AC SpeciÞcationsÓ
Section 1.4.2.4, ÒL2 Clock AC SpeciÞcationsÓ
Section 1.4.2.5, ÒL2 Bus Input AC SpeciÞcationsÓ
Section 1.4.2.6, ÒL2 Bus Output AC SpeciÞcationsÓ
Section 1.5, ÒPin AssignmentsÓ
Section 1.6, ÒPinout ListingsÓ
Section 1.7, ÒPackage DescriptionÓ
Section 1.8, ÒSystem Design InformationÓ
Section 1.9, ÒDocument Revision HistoryÓ
To locate any published errata or updates for this document, refer to the website at
http://www.mot.com/PowerPC/.
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XPC750P RISC Microprocessor Hardware SpeciÞcations
PRELIMINARYÑSUBJECT TO CHANGE WITHOUT NOTICE
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Overview
1.1 Overview
This section is unchanged from the MPC750 Hardware SpeciÞcation; refer to that document for this
information.
1.2 Features
This section is unchanged from the MPC750 Hardware SpeciÞcation except as relates to supply voltage;
refer to that document for feature information and to this document for applicable supply voltage.
1.3 General Parameters
The following list provides a summary of the general parameters of the XPC750P:
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Technology
Die size
Transistor count
Logic design
Packages
0.18 µm CMOS, Þve-layer metal
7.56 mm x 8.79 mm (67 mm
2
)
6.35 million
Fully-static
XPC740P: Surface mount 255 ceramic ball grid array (CBGA) without L2
interface
XPC750P: Surface mount 360 ceramic ball grid array (CBGA) with L2
interface
Core power supply:
I/O power supply
1.9V ± 100 mV @300 and 333MHz
2.05V ± 50mV @366 and 400MHz
3.3V ± 5% V dc
XPC750P RISC Microprocessor Hardware SpeciÞcations
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Electrical and Thermal Characteristics
1.4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical speciÞcations and thermal characteristics for the XPC750P.
1.4.1 DC Electrical Characteristics
The tables in this section describe the XPC750P DC electrical characteristics. Table 2. provides the absolute
maximum ratings.
Table 2. Absolute Maximum Ratings
Characteristic
Core supply voltage
PLL supply voltage
Symbol
Vdd
AVdd
L2AVdd
OVdd
L2OVdd
V
in
T
stg
XPC750P Value
Ð0.3 to 2.5
Ð0.3 to 2.5
Ð0.3 to 2.5
Ð0.3 to 3.6
Ð0.3 to 3.6
Ð0.3 to 3.6
Ð55 to 150
Unit
V
V
V
V
V
V
¡C
Notes
4
4
4
3,5
3,5
2
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L2 DLL supply voltage
60x bus supply voltage
L2 bus supply voltage
Input voltage
Storage temperature range
Notes
:
1. Functional and tested operating conditions are given in Table 3.. Absolute maximum
ratings are stress ratings only, and functional operation at the maximums is not
guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2.
Caution
: Vin must not exceed OVdd/L2OVdd by more than 0.3V at any time including
during power-on reset.
3.
Caution
: OVdd/L2OVdd must not exceed Vdd/AVdd by more than 2.0V at any time
including during power-on reset.
4.
Caution
: Vdd/AVdd/L2AVdd must not exceed OVdd/L2OVdd by more than 0.4V at any
time including during power-on reset.
5. V
in
may overshoot/undershoot to a voltage and for a maximum duration as shown in
Figure 1.
4
XPC750P RISC Microprocessor Hardware SpeciÞcations
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Electrical and Thermal Characteristics
Figure 1. shows the permitted undershoot and overshoot voltage on the XPC750P.
4V
(L2)OVdd + 5%
(L2)OVdd
V
IH
V
IL
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Gnd
Gnd - .3V
Gnd - 1.0V
Not to exceed 10%
of t
SYSCLK
Figure 1. Overshoot/Undershoot Voltage
Table 3. provides the recommended operating conditions for the XPC750P.
Table 3. Recommended Operating Conditions
Characteristic
Core supply voltage
PLL supply voltage
L2 DLL supply voltage
60x bus supply voltage
L2 bus supply voltage
Input voltage
Die-junction temperature
Symbol
Vdd
AVdd
L2AVdd
OVdd
L2OVdd
V
in
T
j
300, 333MHz
1.9 ± 100mv
1.9 ± 100mv
1.9 ± 100mv
3.3 ± 165mv
3.3 ± 165mv
GND to OVdd
0 to 105
366MHz
2.05 ± 50mv
2.05 ± 50mv
2.05 ± 50mv
3.3 ± 165mv
3.3 ± 165mv
GND to OVdd
0 to 105
400MHz
2.05 ± 50mv
2.05 ± 50mv
2.05 ± 50mv
3.3 ± 165mv
3.3 ± 165mv
GND to OVdd
0 to 65
Unit
V
V
V
V
V
V
¡C
Note:
These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
Table 4. provides the package thermal characteristics for the XPC750P.
Table 4. Package Thermal Characteristics
Characteristic
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
CBGA package thermal resistance, die junction-to-lead thermal resistance (typical)
Symbol
q
JC
q
JB
Value
0.03
3.8
Rating
¡C/W
¡C/W
Note:
Refer to Section 1.8, ÒSystem Design Information,Ó for more details about thermal management.
XPC750P RISC Microprocessor Hardware SpeciÞcations
PRELIMINARYÑSUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
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