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Datasheet> 器件分类 > 存储> 存储> AT45DB161B-CL-2.5

AT45DB161B-CL-2.5: 产品描述Flash, 16MX1, PBGA24, 6 X 8 MM, 1.40 MM HIEGHT, 1 MM PITCH, PLASTIC, CBGA-24; 产品类别存储存储; 文件大小352KB，共33页; 制造商Atmel (Microchip); 标准

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AT45DB161B-CL-2.5概述

Flash, 16MX1, PBGA24, 6 X 8 MM, 1.40 MM HIEGHT, 1 MM PITCH, PLASTIC, CBGA-24

AT45DB161B-CL-2.5规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Atmel (Microchip)
零件包装代码	BGA
包装说明	LBGA,
针数	24
Reach Compliance Code	compliant
ECCN代码	EAR99
Is Samacsys	N
其他特性	ORGANISED AS 4096 PAGES OF 528 BYTES EACH
最大时钟频率 (fCLK)	15 MHz
JESD-30 代码	R-PBGA-B24
JESD-609代码	e1
长度	8 mm
内存密度	16777216 bit
内存集成电路类型	FLASH
内存宽度	1
湿度敏感等级	3
功能数量	1
端子数量	24
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	16MX1
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
编程电压	2.7 V
认证状态	Not Qualified
座面最大高度	1.4 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	2.7 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
类型	NOR TYPE
宽度	6 mm
Base Number Matches	1

AT45DB161B-CL-2.5相似产品对比

	AT45DB161B-CL-2.5	AT45DB161B-CL	AT45DB161B-TL	AT45DB161B-TL-2.5	AT45DB161B-RL	AT45DB161B-RL-2.5	AT45DB161B-CNL	AT45DB161B-CJ	AT45DB161B-CNL-2.5
描述	Flash, 16MX1, PBGA24, 6 X 8 MM, 1.40 MM HIEGHT, 1 MM PITCH, PLASTIC, CBGA-24	Flash, 16MX1, PBGA24, 6 X 8 MM, 1.40 MM HIEGHT, 1 MM PITCH, PLASTIC, CBGA-24	Flash, 16MX1, PDSO28, 8 X 13.40 MM, PLASTIC, MO-183, TSOP1-28	Flash, 16MX1, PDSO28, 8 X 13.40 MM, PLASTIC, MO-183, TSOP1-28	Flash, 16MX1, PDSO28, 0.300 INCH, PLASTIC, SOIC-28	Flash, 16MX1, PDSO28, 0.300 INCH, PLASTIC, SOIC-28	Flash, 16MX1, 6 X 8 MM, 1 MM HEIGHT, 1.27 MM PITCH, CASON-8	Flash, 16MX1, PBGA24, 6 X 8 MM, 1.40 MM HIEGHT, 1 MM PITCH, PLASTIC, CBGA-24	Flash, 16MX1, 6 X 8 MM, 1 MM HEIGHT, 1.27 MM PITCH, CASON-8
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
零件包装代码	BGA	BGA	TSOP1	TSOP1	SOIC	SOIC	SON	BGA	SON
包装说明	LBGA,	6 X 8 MM, 1.40 MM HIEGHT, 1 MM PITCH, PLASTIC, CBGA-24	8 X 13.40 MM, PLASTIC, MO-183, TSOP1-28	8 X 13.40 MM, PLASTIC, MO-183, TSOP1-28	0.300 INCH, PLASTIC, SOIC-28	0.300 INCH, PLASTIC, SOIC-28	VSON,	LBGA,	VSON,
针数	24	24	28	28	28	28	8	24	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
其他特性	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH	ORGANISED AS 4096 PAGES OF 528 BYTES EACH
最大时钟频率 (fCLK)	15 MHz	20 MHz	20 MHz	15 MHz	20 MHz	15 MHz	20 MHz	20 MHz	15 MHz
JESD-30 代码	R-PBGA-B24	R-PBGA-B24	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-XDSO-N8	R-PBGA-B24	R-XDSO-N8
长度	8 mm	8 mm	11.8 mm	11.8 mm	18.25 mm	18.25 mm	8 mm	8 mm	8 mm
内存密度	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	1	1	1	1	1	1	1	1	1
湿度敏感等级	3	3	3	3	1	1	3	3	3
功能数量	1	1	1	1	1	1	1	1	1
端子数量	24	24	28	28	28	28	8	24	8
字数	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
字数代码	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C	70 °C
组织	16MX1	16MX1	16MX1	16MX1	16MX1	16MX1	16MX1	16MX1	16MX1
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED
封装代码	LBGA	LBGA	TSOP1	TSOP1	SOP	SOP	VSON	LBGA	VSON
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, VERY THIN PROFILE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260
编程电压	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.4 mm	1.4 mm	1.2 mm	1.2 mm	2.79 mm	2.79 mm	1 mm	1.4 mm	1 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.5 V	2.7 V	2.7 V	2.5 V	2.7 V	2.5 V	2.7 V	2.7 V	2.5 V
标称供电电压 (Vsup)	2.7 V	3 V	3 V	2.7 V	3 V	2.7 V	3 V	3 V	2.7 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
端子面层	TIN SILVER COPPER	TIN SILVER COPPER	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	COPPER NICKEL GOLD	TIN SILVER COPPER	COPPER NICKEL GOLD
端子形式	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	BALL	NO LEAD
端子节距	1 mm	1 mm	0.55 mm	0.55 mm	1.27 mm	1.27 mm	1.27 mm	1 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM	DUAL
处于峰值回流温度下的最长时间	40	40	40	40	40	40	40	40	40
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	6 mm	6 mm	8 mm	8 mm	8.69 mm	8.69 mm	6 mm	6 mm	6 mm
JESD-609代码	e1	e1	e3	e3	e3	e3	-	e1	-

AT45DB161B-CL-2.5

AT45DB161B-CL-2.5概述

AT45DB161B-CL-2.5规格参数

AT45DB161B-CL-2.5相似产品对比

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