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Datasheet> 器件分类 > 可编程逻辑器件> 可编程逻辑> M5LV-384/192-10AC

M5LV-384/192-10AC: 产品描述EE PLD, 16ns, 384-Cell, CMOS, PBGA256, BGA-256; 产品类别可编程逻辑器件可编程逻辑; 文件大小2MB，共62页; 制造商AMD(超微); 官网地址http://www.amd.com

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M5LV-384/192-10AC概述

EE PLD, 16ns, 384-Cell, CMOS, PBGA256, BGA-256

M5LV-384/192-10AC规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	AMD(超微)
零件包装代码	BGA
包装说明	LBGA, BGA256,20X20,50
针数	256
Reach Compliance Code	unknown
Is Samacsys	N
其他特性	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE
最大时钟频率	58 MHz
系统内可编程	YES
JESD-30 代码	S-PBGA-B256
JESD-609代码	e0
JTAG BST	YES
长度	27 mm
专用输入次数
I/O 线路数量	192
宏单元数	384
端子数量	256
最高工作温度	70 °C
最低工作温度
组织	0 DEDICATED INPUTS, 192 I/O
输出函数	MACROCELL
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装等效代码	BGA256,20X20,50
封装形状	SQUARE
封装形式	GRID ARRAY, LOW PROFILE
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3.3 V
可编程逻辑类型	EE PLD
传播延迟	16 ns
认证状态	Not Qualified
座面最大高度	1.65 mm
最大供电电压	3.6 V
最小供电电压	3 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	27 mm
Base Number Matches	1

M5LV-384/192-10AC相似产品对比

	M5LV-384/192-10AC	M5LV-384/192-7AC	M5LV-384/192-15AC	M5LV-384/192-12AC	M5LV-384/184-15HC	M5LV-384/184-12HC	M5LV-384/184-10HC	M5LV-384/184-7HC
描述	EE PLD, 16ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 14ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 20ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 18ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 20ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240	EE PLD, 18ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240	EE PLD, 16ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240	EE PLD, 14ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)
零件包装代码	BGA	BGA	BGA	BGA	QFP	QFP	QFP	QFP
包装说明	LBGA, BGA256,20X20,50	LBGA, BGA256,20X20,50	LBGA, BGA256,20X20,50	LBGA, BGA256,20X20,50	HFQFP, HQFP240,1.37SQ,20	HFQFP, HQFP240,1.37SQ,20	HFQFP, HQFP240,1.37SQ,20	HFQFP, HQFP240,1.37SQ,20
针数	256	256	256	256	240	240	240	240
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE
最大时钟频率	58 MHz	71 MHz	42 MHz	47.6 MHz	42 MHz	47.6 MHz	58 MHz	71 MHz
系统内可编程	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PQFP-G240	S-PQFP-G240	S-PQFP-G240	S-PQFP-G240
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
JTAG BST	YES	YES	YES	YES	YES	YES	YES	YES
长度	27 mm	27 mm	27 mm	27 mm	32 mm	32 mm	32 mm	32 mm
I/O 线路数量	192	192	192	192	184	184	184	184
宏单元数	384	384	384	384	384	384	384	384
端子数量	256	256	256	256	240	240	240	240
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 184 I/O	0 DEDICATED INPUTS, 184 I/O	0 DEDICATED INPUTS, 184 I/O	0 DEDICATED INPUTS, 184 I/O
输出函数	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LBGA	LBGA	LBGA	LBGA	HFQFP	HFQFP	HFQFP	HFQFP
封装等效代码	BGA256,20X20,50	BGA256,20X20,50	BGA256,20X20,50	BGA256,20X20,50	HQFP240,1.37SQ,20	HQFP240,1.37SQ,20	HQFP240,1.37SQ,20	HQFP240,1.37SQ,20
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
可编程逻辑类型	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
传播延迟	16 ns	14 ns	20 ns	18 ns	20 ns	18 ns	16 ns	14 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.65 mm	1.65 mm	1.65 mm	1.65 mm	4.1 mm	4.1 mm	4.1 mm	4.1 mm
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	BALL	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	27 mm	27 mm	27 mm	27 mm	32 mm	32 mm	32 mm	32 mm

M5LV-384/192-10AC

M5LV-384/192-10AC概述

M5LV-384/192-10AC规格参数

M5LV-384/192-10AC相似产品对比

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