Microprogram Sequencer, CMOS, PQCC68
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 包装说明 | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 代码 | S-PQCC-J68 |
| JESD-609代码 | e0 |
| 端子数量 | 68 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 35 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| Base Number Matches | 1 |
| AM29C111-1JC | AM29C111-1GC | AM29C111-1GCB | AM29C111-1JCB | AM29C111GCB | AM29C111JC | AM29C111JCB | |
|---|---|---|---|---|---|---|---|
| 描述 | Microprogram Sequencer, CMOS, PQCC68 | Microprogram Sequencer, CMOS, CPGA68 | Microprogram Sequencer, CMOS, CPGA68 | Microprogram Sequencer, CMOS, PQCC68 | Microprogram Sequencer, CMOS, CPGA68 | Microprogram Sequencer, CMOS, PQCC68 | Microprogram Sequencer, CMOS, PQCC68 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 包装说明 | QCCJ, LDCC68,1.0SQ | PGA, PGA68,11X11 | PGA, PGA68,11X11 | QCCJ, LDCC68,1.0SQ | PGA, PGA68,11X11 | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N | N | N | N |
| JESD-30 代码 | S-PQCC-J68 | S-XPGA-P68 | S-XPGA-P68 | S-PQCC-J68 | S-XPGA-P68 | S-PQCC-J68 | S-PQCC-J68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | PGA | PGA | QCCJ | PGA | QCCJ | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ | PGA68,11X11 | PGA68,11X11 | LDCC68,1.0SQ | PGA68,11X11 | LDCC68,1.0SQ | LDCC68,1.0SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | GRID ARRAY | GRID ARRAY | CHIP CARRIER | GRID ARRAY | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大压摆率 | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | PIN/PEG | PIN/PEG | J BEND | PIN/PEG | J BEND | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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