UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | DIP |
| 包装说明 | WDIP, DIP28,.6 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 200 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-GDIP-T28 |
| JESD-609代码 | e0 |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 13 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.969 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.02 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| NMC27C64QE200 | NMC27C64Q150 | NMC27C64DWF | NMC27C64Q250 | NMC27C64QE150 | NMC27C64NE150 | NMC27C64NE200 | |
|---|---|---|---|---|---|---|---|
| 描述 | UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | OTP ROM, 8KX8, CMOS, | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | OTP ROM, 8KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 | OTP ROM, 8KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| 包装说明 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | DIE, | WINDOWED, CERDIP-28 | WDIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-GDIP-T28 | R-GDIP-T28 | X-XUUC-N27 | R-GDIP-T28 | R-GDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | UVPROM | UVPROM | OTP ROM | UVPROM | UVPROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 27 | 28 | 28 | 28 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | WDIP | WDIP | DIE | WDIP | WDIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW | IN-LINE, WINDOW | UNCASED CHIP | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | - | DIP | DIP | DIP | DIP |
| 针数 | 28 | 28 | - | 28 | 28 | 28 | 28 |
| 最长访问时间 | 200 ns | 150 ns | - | 250 ns | 150 ns | 150 ns | 200 ns |
| I/O 类型 | COMMON | COMMON | - | COMMON | COMMON | COMMON | COMMON |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 最高工作温度 | 85 °C | 70 °C | - | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 13 V | 13 V | - | 13 V | 13 V | 13 V | 13 V |
| 座面最大高度 | 5.969 mm | 5.969 mm | - | 5.969 mm | 5.969 mm | 5.334 mm | 5.334 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.02 mA | 0.02 mA | - | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
| 温度等级 | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | - | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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