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RN1107MFV(TPL3)

产品描述Digital Transistors 100mA 50volts 3Pin 10K x 47Kohms
产品类别分立半导体    晶体管   
文件大小361KB,共6页
制造商Toshiba(东芝)
官网地址http://toshiba-semicon-storage.com/
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RN1107MFV(TPL3)概述

Digital Transistors 100mA 50volts 3Pin 10K x 47Kohms

RN1107MFV(TPL3)规格参数

参数名称属性值
厂商名称Toshiba(东芝)
Reach Compliance Codeunknown
Is SamacsysN
Base Number Matches1

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RN1107MFV~RN1109MFV
TOSHIBA Transistor
Silicon NPN Epitaxial Type (PCT Process)
(Bias Resistor built-in Transistor)
RN1107MFV,RN1108MFV,RN1109MFV
0.22 ± 0.05
Unit: mm
1.2 ± 0.05
0.32 ± 0.05
0.80 ± 0.05
Switching, Inverter Circuit, Interface Circuit and
Driver Circuit Applications
Ultra-small package, suited to very high density mounting
0.8 ± 0.05
1
Incorporating a bias resistor into the transistor reduces the number of
parts, so enabling the manufacture of ever more compact equipment and
lowering assembly cost.
A wide range of resistor values is available for use in various circuits.
Complementary to the RN2107MFV to RN2109MFV
1.2 ± 0.05
0.4
0.4
1
3
2
0.13 ± 0.05
Equivalent Circuit and Bias Resistor Values
0.5 ± 0.05
Type No.
RN1107MFV
RN1108MFV
RN1109MFV
R1 (kΩ)
10
22
47
R2 (kΩ)
47
47
22
1. BASE
VESM
2. EMITTER
3. COLLECTOR
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
Collector current
Collector power dissipation
Junction temperature
Storage temperature range
RN1107MFV
to RN1109MFV
RN1107MFV
RN1108MFV
RN1109MFV
RN1107MFV
to RN1109MFV
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
C
(Note 1)
T
j
T
stg
Rating
50
50
6
7
15
100
150
150
−55
to 150
JEDEC
JEITA
TOSHIBA
2-1L1A
Weight: 1.5 mg (typ.)
Unit
V
V
V
mA
mW
°C
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note 1: Mounted on an FR4 board (25.4 mm
×
25.4 mm
×
1.6 mmt)
Pad Dimension(Reference)
0.5
0.45
Unit:mm
1.15
0.4
0.45
0.4
0.4
1
2010-05-12

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