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Datasheet> 器件分类 > 存储> 存储> S71PL256ND0GFW5B3

S71PL256ND0GFW5B3: 产品描述Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84; 产品类别存储存储; 文件大小2MB，共84页; 制造商SPANSION; 官网地址http://www.spansion.com/; 标准

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S71PL256ND0GFW5B3概述

Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84

S71PL256ND0GFW5B3规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	SPANSION
零件包装代码	BGA
包装说明	VFBGA,
针数	84
Reach Compliance Code	compliant
Is Samacsys	N
JESD-30 代码	R-PBGA-B84
JESD-609代码	e1
长度	11.6 mm
内存密度	268435456 bit
内存集成电路类型	MEMORY CIRCUIT
内存宽度	16
功能数量	1
端子数量	84
字数	16777216 words
字数代码	16000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-25 °C
组织	16MX16
封装主体材料	PLASTIC/EPOXY
封装代码	VFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1 mm
最大供电电压 (Vsup)	3.1 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL EXTENDED
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	8 mm
Base Number Matches	1

S71PL256ND0GFW5B3相似产品对比

	S71PL256ND0GFW5B3	S71PL256ND0GFW5B0	S71PL256ND0GFW5B2	S71PL256ND0GAW5B0	S71PL256ND0GAW5B3	S71PL256ND0GAW5B2
描述	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84
是否Rohs认证	符合	符合	符合	不符合	不符合	不符合
厂商名称	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,
针数	84	84	84	84	84	84
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
JESD-30 代码	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84
长度	11.6 mm	11.6 mm	11.6 mm	11.6 mm	11.6 mm	11.6 mm
内存密度	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit
内存集成电路类型	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
内存宽度	16	16	16	16	16	16
功能数量	1	1	1	1	1	1
端子数量	84	84	84	84	84	84
字数	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
字数代码	16000000	16000000	16000000	16000000	16000000	16000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
组织	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	260	240	240	240
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
最大供电电压 (Vsup)	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
端子形式	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	40	40	40	30	30	30
宽度	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm

S71PL256ND0GFW5B3

S71PL256ND0GFW5B3概述

S71PL256ND0GFW5B3规格参数

S71PL256ND0GFW5B3相似产品对比

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