Very Low Power Consumption
High Gain Optocouplers
Technical Data
HCPL-4701
HCPL-4731
HCPL-070A
HCPL-073A
Features
• Ultra Low Input Current
Capability - 40
µ
A
• Specified for 3 V Operation
Typical Power Consumption:
<1 mW
Input Power: <50
µW
Output Power: <500
µW
• Will Operate with V
CC
as
Low as 1.6 V
• High Current Transfer
Ratio – 3500% at I
F
= 40
µ
A
• TTL and CMOS Compatible
Output
• Specified AC and DC
Performance over
Temperature: 0
°
C to 70
°
C
• Safety Approval
UL Recognized - 3750 V rms
for 1 Minute and
5000 V rms* for 1 minute per
UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with
V
IORM
= 630 V
peak
(Option 060) for HCPL-4701
• 8-Pin Product Compatible
with 6N138/6N139 and
HCPL-2730/HCPL-2731
• Available in 8-Pin DIP and
SOIC-8 Footprint
• Through Hole and Surface
Mount Assembly Available
Applications
• Battery Operated
Applications
• ISDN Telephone Interface
• Ground Isolation between
Logic Families – TTL,
LSTTL, CMOS, HCMOS,
HL-CMOS, LV-HCMOS
• Low Input Current Line
Receiver
• EIA RS-232C Line Receiver
• Telephone Ring Detector
• AC Line Voltage Status
Indicator - Low Input Power
Dissipation
• Low Power Systems –
Ground Isolation
• Portable System I/O
Interface
Functional Diagram
HCPL-4701/070A
NC 1
ANODE 2
CATHODE 3
NC 4
8 V
CC
7 V
B
6 V
O
5 GND
ANODE
1
1
CATHODE
1
2
CATHODE
2
3
ANODE
2
4
HCPL-4731/073A
8 V
CC
7 V
O1
6 V
O2
5 GND
TRUTH TABLE
V
O
LED
LOW
ON
HIGH
OFF
*5000 V rms/1 Minute rating is for Option 020 (HCPL-4701 and HCPL-4731) products only.
A 0.1
µF
bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
Description
These devices are very low power
consumption, high gain single
and dual channel optocouplers.
The HCPL-4701 represents the
single channel 8-Pin DIP configu-
ration and is pin compatible with
the industry standard 6N139. The
HCPL-4731 represents the dual
channel 8-Pin DIP configuration
and is pin compatible with the
popular standard HCPL-2731.
The HCPL-070A and HCPL-073A
are the equivalent single and dual
channel products in an SO-8
footprint. Each channel can be
driven with an input current as
low as 40
µA
and has a typical
current transfer ratio of 3500%.
These high gain couplers use an
AlGaAs LED and an integrated
high gain photodetector to
provide an extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage results in TTL compatible
saturation voltages and high
speed operation. Where desired,
the V
CC
and V
O
terminals may be
tied together to achieve conven-
tional Darlington operation
(single channel package only).
These devices are designed for
use in CMOS, LSTTL or other low
power applications. They are
especially well suited for ISDN
telephone interface and battery
operated applications due to the
low power consumption. A 700%
minimum current transfer ratio is
guaranteed from 0°C to 70°C
operating temperature range at
40
µA
of LED current and
V
CC
≥
3 V.
The SO-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Selection Guide
8-Pin DIP
(300 Mil)
Dual
Single
Channel
Channel
Package
Package
HCPL-
6N139
[1]
6N138
[1]
HCPL-4701
2731
[1]
2730
[1]
4731
Widebody
Package
(400 mil)
Single
Channel
Package
HCNW139
[1]
HCNW138
[1]
Minimum
Input ON
Current
(I
F
)
0.5 mA
1.6 mA
40
µA
0.5 mA
Absolute
Maxi-
mum
V
CC
18 V
7V
18 V
20 V
5701
[1]
5700
[1]
5731
[1]
5730
[1]
Hermetic
Single and
Dual
Channel
Packages
HCPL-
Small Outline SO-8
Single
Dual
Channel
Channel
Package
Package
HCPL-
HCPL-
0701
[1]
0700
[1]
070A
0731
[1]
0730
[1]
0730A
Minimum
CTR
400%
300%
800%
300%
Notes:
1. Technical data are on separate Agilent publication.
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-4701#XXXX
020 = 5000 V rms/1 minute UL Rating Option.**
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
= 630 V peak Option†
300 = Gull Wing Surface Mount Option.*
500 = Tape and Reel Packaging Option.
XXXE = Lead Free Option
*Gull wing surface mount option applies to through hole parts only.
**For HCPL-4701 and HCPL-4731 (8-Pin DIP products) only.
†For HCPL-4701 only. Combination of Option 020 and Option 060 is not available.
Option data sheets available. Contact your Agilent sales representative or authorized distributor for information.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “–”
Schematic
HCPL-4701 and HCPL-070A
HCPL-4731 and HCPL-073A
V
CC
8
I
CC
2
ANODE
+
V
F
CATHODE
–
3
I
O
6
I
F
1
+
V
F1
I
F1
I
CC
8
V
CC
–
2
I
O1
V
O1
7
V
O
3
I
B
V
B
7
5
GND
–
V
F2
I
O2
6
V
O2
SHIELD
+
4
I
F2
GND
5
SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 8)
4
Package Outline Drawings
8-Pin DIP Package (HCPL-4701, HCPL-4731)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION CODE*
A XXXXZ
YYWW
1
1.19 (0.047) MAX.
2
3
4
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
DATE CODE
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4701, HCPL-4731)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
Small-Outline SO-8 Package (HCPL-070A, HCPL-073A)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE 1
2
3
1.9 (0.075)
1.270 BSC
(0.050)
7°
0.406 ± 0.076
(0.016 ± 0.003)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Figure 1a. Solder Reflow Thermal Profile.
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