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514-AG21D

产品描述IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder
产品类别连接器    插座   
文件大小55KB,共2页
制造商Thomas & Betts Corporation
官网地址http://www.tnb.com/
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514-AG21D概述

IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder

514-AG21D规格参数

参数名称属性值
厂商名称Thomas & Betts Corporation
Reach Compliance Codeunknown
ECCN代码EAR99
Is SamacsysN
其他特性STANDARD: UL 94V-0
主体宽度0.4 inch
主体深度1.1 inch
主体长度0.9 inch
联系完成配合AU
联系完成终止TIN OVER NICKEL
触点材料BE-CU
触点样式RND PIN-SKT
目前评级3 A
设备插槽类型IC SOCKET
使用的设备类型DIP14
介电耐压1000VAC V
外壳材料THERMOPLASTIC POLYESTER
绝缘电阻5000000000 Ω
制造商序列号500
插接触点节距0.1 inch
安装方式RIGHT ANGLE
触点数14
最高工作温度125 °C
最低工作温度-55 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.3 mm
端子节距2.54 mm
端接类型SOLDER
Base Number Matches1

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500 Series
Numerical Display Sockets
518-AG7D
516-AG21D
508-AG8D
FEATURES:
Augat offers a wide range of LED and ganged unit sockets to
allow for total flexibility and size variations while incorporating
the design features of our standard 500 Series sockets.
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G's
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G's
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 200 Grams (7.0 oz.) average with .018" (0,46) dia.
polished steel pin
Insertion Force .............. 179 Grams (6.3 oz.) average with .018 (0,46)" dia.
polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with .018" (0,46) dia.
polished steel pin
Solderability .................. Passed MIL-STD-202F, Method 208
Sleeve Retention
in Plastic .................... 3.5 Lbs. per line minimum solderless wrap;
3.0 Lbs. PC tail
Inner Contact
Retention .................... 7.5 Lbs. per line average
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55°C to +125°C
Tin/lead inner contact -55°C to +105°C
G
• Two-piece tapered entry socket terminal — four-fingered, gold plated
inner contact and machined tin/lead plated outer sleeve.
• Available in either solderless wrap or printed circuit termination.
• Horizontal or right angle mounting.
MATERIAL SPECIFICATIONS (Figures 1, 2, 3):
Inner Contact .................. Four-fingered beryllium copper, gold
Outer Sleeve .................. Machined brass, tin/lead plated
Insulator ........................ Thermoplastic polyester UL rated 94V-0
MATERIAL SPECIFICATIONS (Figure 4):
Inner Contact .................. Four-fingered beryllium copper, gold
Outer Sleeve .................. Brass, tin/lead plated
Board .............................. Glass epoxy, tin-plated copper circuitry
Terminal ........................ Phosphor bronze, solder-coated
Spacer ............................ Delrin
Quality & Innovation From The
Product Group
G2
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805

 
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