3x2.4mm SMD CHIP LED LAMP
KP-23EC-F
HIGH EFFICIENCY RED
Features
!
3mmx2.4mm SMT
!
LOW
Description
LED, 1.05mm THICKNESS.
The High Efficiency Red source color devices are made
with Gallium Arsenide Phosphide on Gallium Phosphide
Orange Light Emitting Diode.
POWER CONSUMPTION.
VIEWING ANGLE.
FOR BACKLIGHT AND INDICATOR.
COLORS AND LENS TYPES AVAILABLE.
: 2000PCS / REEL.
!
WIDE
!
IDEAL
!
VARIOUS
!
PACKAGE
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
±0.2(0.008")
unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO:DSAA8002
APPROVED : J. Lu
REV NO: V.2
CHECKED : Allen Liu
DATE:JAN/25/2003
DRAWN: L.ZHANG
PAGE: 1 OF 4
Selection Guide
Par t No .
Dic e
L en s Ty p e
Iv (m c d )
@ 20 m A
Min .
KP-23EC-F
HIGH EFFICIENCY RED(GaAsP/GaP)
WATER CLEAR
7
Ty p .
20
V i ew i n g
An g l e
2θ1/2
120°
Note:
1.
θ1/2
is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T
)
=25°C
°
Sy m b o l
λ
peak
λ
D
∆λ
1/2
C
V
F
I
R
Par am et er
Peak Wavelength
Dominate Wavelength
D ev i c e
High Efficiency Red
High Efficiency Red
Ty p .
6 27
6 25
45
15
2.0
2.5
10
Max .
Un it s
nm
nm
nm
pF
V
uA
Tes t Co n d it io n s
I
F
=20mA
I
F
=20mA
I
F
=20mA
V
F
=0V;f =1MHz
I
F
=20mA
V
R
= 5V
Spectral Line Half-width High Efficiency Red
Capacitance
Forward Voltage
Reverse Current
High Efficiency Red
High Efficiency Red
High Efficiency Red
Absolute Maximum Ratings at T
)
=25°C
°
Par am et er
Power dissipation
DC Forward Current
Peak Forward Current [1]
Reverse Voltage
Operating/Storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
H i g h E f f i c i e n c y R ed
105
30
160
5
-40
°
C To +85
°C
Un it s
mW
mA
mA
V
SPEC NO:DSAA8002
APPROVED : J. Lu
REV NO: V.2
CHECKED : Allen Liu
DATE:JAN/25/2003
DRAWN: L.ZHANG
PAGE: 2 OF 4
High Efficiency Red
KP-23EC-F
SPEC NO:DSAA8002
APPROVED : J. Lu
REV NO: V.2
CHECKED : Allen Liu
DATE:JAN/25/2003
DRAWN: L.ZHANG
PAGE: 3 OF 4
KP-23EC-F
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process."
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO:DSAA8002
APPROVED : J. Lu
REV NO: V.2
CHECKED : Allen Liu
DATE:JAN/25/2003
DRAWN: L.ZHANG
PAGE: 4 OF 4