IC,LOGIC GATE,3 3-INPUT NAND,CMOS,SOP,14PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ST(意法半导体) |
Reach Compliance Code | not_compliant |
Is Samacsys | N |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | NAND GATE |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP14,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 3/15 V |
Prop。Delay @ Nom-Sup | 250 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
HCF4023BM | HCF4012BM | HCF4012BE | HCF4023BF | HCF4011BM | HCF4011BE | |
---|---|---|---|---|---|---|
描述 | IC,LOGIC GATE,3 3-INPUT NAND,CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,14PIN,PLASTIC | HCF4023BF | IC,LOGIC GATE,QUAD 2-INPUT NAND,CMOS,SOP,14PIN,PLASTIC | HCF4011BE |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | R-PDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | DIP | SOP | DIP |
封装等效代码 | SOP14,.25 | SOP14,.25 | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO | NO |
表面贴装 | YES | YES | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Prop。Delay @ Nom-Sup | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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