7L SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | QFN |
包装说明 | 3 X 3 MM, LEAD FREE, QFN-16 |
针数 | 16 |
Reach Compliance Code | unknown |
Is Samacsys | N |
系列 | 7L |
输入调节 | DIFFERENTIAL |
JESD-30 代码 | S-XQCC-N16 |
JESD-609代码 | e3 |
长度 | 3 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
湿度敏感等级 | NOT SPECIFIED |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 16 |
实输出次数 | 2 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 0.15 ns |
认证状态 | COMMERCIAL |
Same Edge Skew-Max(tskwd) | 0.015 ns |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 3.465 V |
最小供电电压 (Vsup) | 2.375 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 3 mm |
最小 fmax | 8000 MHz |
Base Number Matches | 1 |
NB7L11MMNG | NB7L11MMNR2G | NB7L11MMN | |
---|---|---|---|
描述 | 7L SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 | 7L SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 | 7L SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, QFN-16 |
是否无铅 | 含铅 | 不含铅 | 不含铅 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | QFN | QFN | QFN |
包装说明 | 3 X 3 MM, LEAD FREE, QFN-16 | 3 X 3 MM, LEAD FREE, QFN-16 | HVQCCN, |
针数 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown |
Is Samacsys | N | N | N |
系列 | 7L | 7L | 7L |
输入调节 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
JESD-30 代码 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 |
JESD-609代码 | e3 | e3 | e0 |
长度 | 3 mm | 3 mm | 3 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
功能数量 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 |
实输出次数 | 2 | 2 | 2 |
最高工作温度 | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 240 |
传播延迟(tpd) | 0.15 ns | 0.15 ns | 0.15 ns |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Same Edge Skew-Max(tskwd) | 0.015 ns | 0.015 ns | 0.015 ns |
座面最大高度 | 1 mm | 1 mm | 1 mm |
最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 2.375 V | 2.375 V | 2.375 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | MATTE TIN | TIN LEAD |
端子形式 | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 40 | 30 |
宽度 | 3 mm | 3 mm | 3 mm |
最小 fmax | 8000 MHz | 8000 MHz | 8000 MHz |
Base Number Matches | 1 | 1 | 1 |
湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | - |
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