Datasheet> 器件分类 > 模拟混合信号IC> 驱动程序和接口> HCC4504BF

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HCC4504BF: 产品描述HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小237KB，共6页; 制造商ST(意法半导体); 官网地址http://www.st.com/

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HCC4504BF概述

HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16

HCC4504BF规格参数

参数名称	属性值
厂商名称	ST(意法半导体)
零件包装代码	DIP
包装说明	FRIT SEALED, CERAMIC, DIP-16
针数	16
Reach Compliance Code	compliant
ECCN代码	EAR99
Is Samacsys	N
最大延迟
接口集成电路类型	TTL/CMOS TO CMOS TRANSLATOR
JESD-30 代码	R-GDIP-T16
长度	19.43 mm
位数	1
功能数量	6
端子数量	16
输出锁存器或寄存器	NONE
输出极性	TRUE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装等效代码	DIP16,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	3/18 V
认证状态	Not Qualified
座面最大高度	5.08 mm
表面贴装	NO
技术	CMOS
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	7.62 mm
Base Number Matches	1

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HCC4504B

HCF4504B

HEX TTL OR CMOS TO CMOS LEVEL SHIFTER

PRODUCT PREVIEW

VERY LOW QUIESCENT CURRENT

HIGH NOISE IMMUNITY

SUPPLY VOLTAGE RANGE 3V TO 18V FOR

AND V

UP TRANSLATES FROM A LOW TO A HIGH

VOLTAGE OR DOWN TRANSLATES FROM A

HIGH TO A LOW VOLTAGE

INPUT THRESHOLD CAN BE SHIFTED FOR

TTL COMPATIBILITY

(Plastic Package)

(Ceramic Frit Seal Package)

(Micro Package)

(Plastic Chip Carrier)

ORDER CODES :

HCC4504 BF

HCF4504 BM1

HCF4504 BEY

HCF4504 BC1

PIN CONNECTION

(top view)

DESCRIPTION

The HCC4504B and HCF4504B are monolithic in-

tegrated circuits, available in 16-lead dual-in-line

plastic or ceramic packages or in 16-pin SO micro-

packages.

The HCC4504B and HCF4504B are hex non-invert-

ing level shifters. They will shift a TTL signal to

CMOS logic levels for any CMOS supply voltage be-

tween 5V and 15V. A control input also allows inter-

face from CMOS to CMOS at one logic level to

another logic level. Either up or down level translat-

ing is accomplished by selection of power supply le-

vels V

and V

. The V

level sets the input signal

levels ; V

selects the output voltage levels.

The supply current is typically 1nA at V

= 10V for

CMOS to CMOS operation. For TTL to CMOS trans-

lation the supply current is typically 2.5mA taken

from V

September 1990

1/6

HCC4504BF相似产品对比

	HCC4504BF	HCF4504BEY	HCF4504BC1
描述	HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16	HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16	HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PQCC20, PLASTIC, LCC-20
厂商名称	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
零件包装代码	DIP	DIP	QLCC
包装说明	FRIT SEALED, CERAMIC, DIP-16	PLASTIC, DIP-16	PLASTIC, LCC-20
针数	16	16	20
Reach Compliance Code	compliant	unknown	compliant
ECCN代码	EAR99	EAR99	EAR99
Is Samacsys	N	N	N
接口集成电路类型	TTL/CMOS TO CMOS TRANSLATOR	TTL/CMOS TO CMOS TRANSLATOR	TTL/CMOS TO CMOS TRANSLATOR
JESD-30 代码	R-GDIP-T16	R-PDIP-T16	S-PQCC-J20
位数	1	1	1
功能数量	6	6	6
端子数量	16	16	20
输出锁存器或寄存器	NONE	NONE	NONE
输出极性	TRUE	TRUE	TRUE
封装主体材料	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	DIP	QCCJ
封装等效代码	DIP16,.3	DIP16,.3	LDCC20,.4SQ
封装形状	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	IN-LINE	IN-LINE	CHIP CARRIER
电源	3/18 V	3/18 V	3/18 V
认证状态	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	5.1 mm	4.57 mm
表面贴装	NO	NO	YES
技术	CMOS	CMOS	CMOS
端子形式	THROUGH-HOLE	THROUGH-HOLE	J BEND
端子节距	2.54 mm	2.54 mm	1.27 mm
端子位置	DUAL	DUAL	QUAD
宽度	7.62 mm	7.62 mm	8.9662 mm
Base Number Matches	1	1	1
长度	19.43 mm	-	8.9662 mm

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