电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MK20X512VMD100R

产品描述RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小998KB,共67页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

MK20X512VMD100R概述

RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144

MK20X512VMD100R规格参数

参数名称属性值
厂商名称NXP(恩智浦)
零件包装代码BGA
包装说明LBGA,
针数144
Reach Compliance Codeunknown
Is SamacsysN
具有ADCYES
地址总线宽度
位大小32
最大时钟频率50 MHz
DAC 通道YES
DMA 通道YES
外部数据总线宽度
JESD-30 代码S-PBGA-B144
长度13 mm
I/O 线路数量100
端子数量144
最高工作温度105 °C
最低工作温度-40 °C
PWM 通道YES
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
认证状态Not Qualified
ROM可编程性FLASH
座面最大高度1.7 mm
速度100 MHz
最大供电电压3.6 V
最小供电电压1.71 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度13 mm
uPs/uCs/外围集成电路类型MICROCONTROLLER, RISC
Base Number Matches1

文档预览

下载PDF文档
Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K20P144M100SF2
Rev. 1, 11/2010
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 1 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2010 Freescale Semiconductor, Inc.
Preliminary
Pr
el
im
in
ar
y
Supports the following:
MK20X128VLQ100,
MK20X128VMD100,
MK20X256VLQ100,
MK20X256VMD100,
MK20N512VLQ100,
MK20N512VMD100
K20 Sub-Family Data Sheet
K20P144M100SF2
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– 16-bit SAR ADC with PGA (x64)
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timers
– Two-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB full-/low-speed On-the-Go controller with on-
chip transceiver
– Controller Area Network (CAN) module
– SPI modules
– I2C modules
– UART modules
– Secure Digital host controller (SDHC)
– I2S

MK20X512VMD100R相似产品对比

MK20X512VMD100R MK20X512VMD100 MK20X512VLQ100 MK20X512VLQ100R
描述 RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144 RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 BGA BGA QFP QFP
包装说明 LBGA, LBGA, LFQFP, LFQFP,
针数 144 144 144 144
Reach Compliance Code unknown unknown unknown unknown
具有ADC YES YES YES YES
位大小 32 32 32 32
最大时钟频率 50 MHz 50 MHz 50 MHz 50 MHz
DAC 通道 YES YES YES YES
DMA 通道 YES YES YES YES
JESD-30 代码 S-PBGA-B144 S-PBGA-B144 S-PQFP-G144 S-PQFP-G144
长度 13 mm 13 mm 20 mm 20 mm
I/O 线路数量 100 100 100 100
端子数量 144 144 144 144
最高工作温度 105 °C 105 °C 105 °C 105 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
PWM 通道 YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
ROM可编程性 FLASH FLASH FLASH FLASH
座面最大高度 1.7 mm 1.7 mm 1.6 mm 1.6 mm
速度 100 MHz 100 MHz 100 MHz 100 MHz
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 1.71 V 1.71 V 1.71 V 1.71 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL GULL WING GULL WING
端子节距 1 mm 1 mm 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM QUAD QUAD
宽度 13 mm 13 mm 20 mm 20 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1703  2406  1732  1605  1600  35  49  33  2  23 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved