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SN54F374FK

产品描述Bus Driver, F/FAST Series, 1-Func, 8-Bit, True Output, TTL, CQCC20, CERAMIC, LCC-20
产品类别逻辑    逻辑   
文件大小159KB,共8页
制造商Rochester Electronics
官网地址https://www.rocelec.com/
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SN54F374FK概述

Bus Driver, F/FAST Series, 1-Func, 8-Bit, True Output, TTL, CQCC20, CERAMIC, LCC-20

SN54F374FK规格参数

参数名称属性值
厂商名称Rochester Electronics
包装说明CERAMIC, LCC-20
Reach Compliance Codeunknown
Is SamacsysN
系列F/FAST
JESD-30 代码S-CQCC-N20
长度8.89 mm
逻辑集成电路类型BUS DRIVER
位数8
功能数量1
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性TRUE
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装形状SQUARE
封装形式CHIP CARRIER
传播延迟(tpd)11 ns
座面最大高度2.03 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术TTL
温度等级MILITARY
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
宽度8.89 mm
Base Number Matches1

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SN54F374, SN74F374
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDFS077A – D2932, MARCH 1987 – REVISED OCTOBER 1993
Eight D-Type Flip-Flops in a Single Package
3-State Bus-Driving True Outputs
Full Parallel Access for Loading
Buffered Control Inputs
Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
SN54F374 . . . J PACKAGE
SN74F374 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
description
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
The eight flip-flops of the
′F374
are edge-triggered
D-type flip-flops. On the positive transition of the
clock (CLK) input, the Q outputs are set to the logic
levels that were set up at the data (D) inputs.
A buffered output enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low) or a high-impedance state. In
the high-impedance state, the outputs neither
load nor drive the bus lines significantly. The
high-impedance state and the increased drive
provide the capability to drive bus lines without
need for interface or pullup components.
2D
2Q
3Q
3D
4D
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
SN54F374 . . . FK PACKAGE
(TOP VIEW)
1D
1Q
OE
V
CC
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
8Q
8D
7D
7Q
6Q
6D
The output enable (OE) input does not affect internal operations of the flip-flop. Old data can be retained or new
data can be entered while the outputs are in the high-impedance state.
The SN74F374 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F374 is characterized for operation over the full military temperature range of – 55°C to 125°C. The
SN74F374 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
L
L
L
H
CLK
H or L
X
D
H
L
X
X
OUTPUT
Q
H
L
Q0
Z
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
4Q
GND
CLK
5Q
5D
Copyright
©
1993, Texas Instruments Incorporated
2–1

 
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