Datasheet> 器件分类 > 存储> 存储> MT48LC32M8A2TG-6A

文档预览

MT48LC32M8A2TG-6A: 产品描述Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, TSOP2-54; 产品类别存储存储; 文件大小2MB，共92页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/

下载文档详细参数全文预览

MT48LC32M8A2TG-6A概述

Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, TSOP2-54

MT48LC32M8A2TG-6A规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Micron Technology
零件包装代码	TSOP2
包装说明	TSOP2, TSOP54,.46,32
针数	54
Reach Compliance Code	not_compliant
ECCN代码	EAR99
Is Samacsys	N
访问模式	FOUR BANK PAGE BURST
最长访问时间	5.4 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	167 MHz
I/O 类型	COMMON
交错的突发长度	1,2,4,8
JESD-30 代码	R-PDSO-G54
JESD-609代码	e0
长度	22.22 mm
内存密度	268435456 bit
内存集成电路类型	SYNCHRONOUS DRAM
内存宽度	8
功能数量	1
端口数量	1
端子数量	54
字数	33554432 words
字数代码	32000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	32MX8
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TSOP2
封装等效代码	TSOP54,.46,32
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE
峰值回流温度（摄氏度）	235
电源	3.3 V
认证状态	Not Qualified
刷新周期	8192
座面最大高度	1.2 mm
自我刷新	YES
连续突发长度	1,2,4,8,FP
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.8 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	10.16 mm
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

256Mb: x4, x8, x16 SDRAM

Features

SDR SDRAM

MT48LC64M4A2 – 16 Meg x 4 x 4 banks

MT48LC32M8A2 – 8 Meg x 8 x 4 banks

MT48LC16M16A2 – 4 Meg x 16 x 4 banks

Features

•

PC100- and PC133-compliant

•

Fully synchronous; all signals registered on positive

edge of system clock

•

Internal, pipelined operation; column address can

be changed every clock cycle

•

Internal banks for hiding row access/precharge

•

Programmable burst lengths: 1, 2, 4, 8, or full page

•

Auto precharge, includes concurrent auto pre-

charge and auto refresh modes

•

Self refresh mode (not available on AT devices)

•

Auto refresh

–

64ms, 8192-cycle (commercial and industrial)

–

16ms, 8192-cycle (automotive)

•

LVTTL-compatible inputs and outputs

•

Single +3.3V ±0.3V power supply

Table 1: Address Table

Parameter

Configuration

Refresh count

Row addressing

Bank addressing

Column

addressing

64 Meg x 4 32 Meg x 8

16 Meg x 4

x 4 banks

8K A[12:0]

4 BA[1:0]

2K A[9:0],

A11

8 Meg x 8 x

4 banks

8K A[12:0]

4 BA[1:0]

1K A[9:0]

16 Meg

x 16

4 Meg x 16

x 4 banks

8K A[12:0]

4 BA[1:0]

512 A[8:0]

Options

•

Configurations

–

64 Meg x 4 (16 Meg x 4 x 4 banks)

–

32 Meg x 8 (8 Meg x 8 x 4 banks)

–

16 Meg x 16 (4 Meg x 16 x 4 banks)

•

Write recovery (

WR)

–

WR = 2 CLK

•

Plastic package – OCPL

–

54-pin TSOP II OCPL

(400 mil)

(standard)

–

54-pin TSOP II OCPL

(400 mil)

Pb-free

–

60-ball FBGA (x4, x8) (8mm x 16mm)

–

60-ball FBGA (x4, x8) (8mm x 16mm)

Pb-free

–

54-ball VFBGA (x16) (8mm x 14 mm)

–

54-ball VFBGA (x16) (8mm x 14 mm)

Pb-free

•

Timing – cycle time

–

6ns @ CL = 3 (x8, x16 only)

–

7.5ns @ CL = 3 (PC133)

–

7.5ns @ CL = 2 (PC133)

•

Self refresh

–

Standard

–

Low power

•

Operating temperature range

–

Commercial (0˚C to +70˚C)

–

Industrial (–40˚C to +85˚C)

–

Automotive (–40˚C to +105˚C)

•

Revision

Notes:

Marking

64M4

32M8

16M16

-6A

-75

-7E

None

Table 2: Key Timing Parameters

CL = CAS (READ) latency

Speed

Grade

-6A

-7E

-75

-7E

-75

Clock

Frequency

167 MHz

143 MHz

133 MHz

100 MHz

Setup

CL = 2 CL = 3 Time

–

5.4ns

6ns

5.4ns

–

1.5ns

Access Time

Hold

Time

0.8ns

1. See Micron technical note TN-48-05 on

Micron's Web site.

2. Off-center parting line.

3. Contact Micron for availability.

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. N 1/10 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 SDRAM

General Description ......................................................................................................................................... 8

Automotive Temperature ............................................................................................................................. 8

Functional Block Diagrams ............................................................................................................................... 9

Pin and Ball Assignments and Descriptions ..................................................................................................... 12

Package Dimensions ...................................................................................................................................... 16

Temperature and Thermal Impedance ............................................................................................................ 19

Electrical Specifications .................................................................................................................................. 22

Electrical Specifications – I

Parameters ........................................................................................................ 24

Electrical Specifications – AC Operating Conditions ......................................................................................... 26

Functional Description ................................................................................................................................... 31

Commands .................................................................................................................................................... 32

COMMAND INHIBIT .................................................................................................................................. 32

NO OPERATION (NOP) .............................................................................................................................. 33

LOAD MODE REGISTER (LMR) ................................................................................................................... 33

ACTIVE ...................................................................................................................................................... 33

READ ......................................................................................................................................................... 34

WRITE ....................................................................................................................................................... 35

PRECHARGE .............................................................................................................................................. 36

BURST TERMINATE ................................................................................................................................... 36

AUTO REFRESH ......................................................................................................................................... 37

SELF REFRESH ........................................................................................................................................... 37

Truth Tables ................................................................................................................................................... 38

Initialization .................................................................................................................................................. 43

Mode Register ................................................................................................................................................ 46

Burst Length .............................................................................................................................................. 48

Burst Type ................................................................................................................................................. 48

CAS Latency ............................................................................................................................................... 50

Operating Mode ......................................................................................................................................... 50

Write Burst Mode ....................................................................................................................................... 50

Bank/Row Activation ...................................................................................................................................... 51

READ Operation ............................................................................................................................................. 52

WRITE Operation ........................................................................................................................................... 61

Burst Read/Single Write .............................................................................................................................. 68

PRECHARGE Operation .................................................................................................................................. 69

Auto Precharge ........................................................................................................................................... 69

AUTO REFRESH Operation ............................................................................................................................. 81

SELF REFRESH Operation .............................................................................................................................. 83

Power-Down .................................................................................................................................................. 85

Clock Suspend ............................................................................................................................................... 86

Revision History ............................................................................................................................................. 89

Rev. N – 1/10 .............................................................................................................................................. 89

Rev. M – 11/08 ............................................................................................................................................ 89

Rev. L – 8/07 ............................................................................................................................................... 89

Rev. K – 2/07 .............................................................................................................................................. 90

Rev. K – 6/06 .............................................................................................................................................. 90

Rev. J – 3/05 ............................................................................................................................................... 90

Rev. H – 2/05 .............................................................................................................................................. 90

Rev. H – 10/04 ............................................................................................................................................ 90

Rev. G – 8/03 .............................................................................................................................................. 90

Rev. F – 1/03 ............................................................................................................................................... 90

Contents

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. N 1/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 SDRAM

Table 1: Address Table .................................................................................................................................... 1

Table 2: Key Timing Parameters ...................................................................................................................... 1

Table 3: 256Mb SDR Part Numbering ............................................................................................................... 2

Table 4: Pin and Ball Descriptions .................................................................................................................. 15

Table 5: Temperature Limits .......................................................................................................................... 19

Table 6: Thermal Impedance Simulated Values .............................................................................................. 20

Table 7: Absolute Maximum Ratings .............................................................................................................. 22

Table 8: DC Electrical Characteristics and Operating Conditions ..................................................................... 22

Table 9: Capacitance ..................................................................................................................................... 23

Table 10: I

Specifications and Conditions (-6A) ........................................................................................... 24

Table 11: I

Specifications and Conditions (-7E, -75) .................................................................................... 24

Table 12: Electrical Characteristics and Recommended AC Operating Conditions (-6A) ................................... 26

Table 13: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75) ............................. 27

Table 14: AC Functional Characteristics (-6A) ................................................................................................. 28

Table 15: AC Functional Characteristics (-7E, -75) .......................................................................................... 29

Table 16: Truth Table – Commands and DQM Operation ................................................................................ 32

Table 17: Truth Table – Current State Bank

Command to Bank

................................................................. 38

Table 18: Truth Table – Current State Bank n, Command to Bank

................................................................ 40

Table 19: Truth Table – CKE .......................................................................................................................... 42

Table 20: Burst Definition Table .................................................................................................................... 49

List of Tables

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. N 1/10 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT48LC32M8A2TG-6A

MT48LC32M8A2TG-6A概述

MT48LC32M8A2TG-6A规格参数

文档预览

推荐资源