RF and Baseband Circuit, PQFP48, 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFP |
| 包装说明 | TFQFP, |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| JESD-30 代码 | S-PQFP-G48 |
| JESD-609代码 | e3 |
| 长度 | 7 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 标称供电电压 | 2.75 V |
| 表面贴装 | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7 mm |
| Base Number Matches | 1 |
| MAX2364ECM+T | MAX2362ECM+ | MAX2360ECM+ | MAX2364ECM+ | MAX2362ECM+T | MAX2360ECM+T | |
|---|---|---|---|---|---|---|
| 描述 | RF and Baseband Circuit, PQFP48, 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-48 | RF and Baseband Circuit, PQFP48, 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-48 | RF and Baseband Circuit, PQFP48, 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-48 | RF and Baseband Circuit, PQFP48, 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-48 | RF and Baseband Circuit, PQFP48, 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-48 | RF and Baseband Circuit, PQFP48, 7 X 7 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-48 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | TFQFP, | TFQFP, | TFQFP, | TFQFP, | TFQFP, | TFQFP, |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 代码 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
| 湿度敏感等级 | 1 | 3 | 3 | 3 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 标称供电电压 | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | TIN | TIN | TIN | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
| Is Samacsys | N | N | N | N | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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