IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| JESD-30 代码 | R-PDIP-T16 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 功能数量 | 6 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| SN74HC378NP1 | SN74HC378N1 | SN74HC379NP1 | SN74HC379N1 | SN74HC378FN | SN54HC378FH | SN54HC379FH | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,LDCC,20PIN,PLASTIC | IC,FLIP-FLOP,HEX,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | S-PQCC-J20 | S-XQCC-N20 | S-XQCC-N20 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 功能数量 | 6 | 6 | 4 | 4 | 6 | 6 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | QCCJ | QCCN | QCCN |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ | LCC20,.35SQ | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Is Samacsys | N | N | N | N | - | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
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