F-212-1
QTE–014–01–F–D–DP–A
®
QTE–014–01–L–D–A–RT1
(0,80 mm) .0315"
QTE SERIES
QTE–060–01–L–D–A
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Integral metal plane
for power or ground
Standard stack heights
from 5 mm to 25 mm
®
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TM
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nch.com
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSE
ols
otoc ted
Pr or
Supp
XAUI
®
PCI Express
SATA
et I/O)
MGT (Rock
™
InfiniBand
QTE/QSE
5mm Stack Height
Processing:
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D 9 GHz / 18 Gbps
9 GHz / 18 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps
14 GHz / 28 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
Type
Polarized
ALSO
AVAILABLE
Board Spacing Standoffs.
See SO Series.
notes at
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG n protocols
o
for questions
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
(0,15 mm) .006" max (080)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
–020, –040, –060, –080
(40 total pins per bank = –D)
APPLICATION
SPECIFIC OPTION
• 14mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 100 positions per row
• Guide Posts, Screw Down
& Friction Lock
Call Samtec.
–014, –028, –042, –056
(14 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–K
–F
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
= (7,00 mm)
.275" DIA
Polyimide Film
Pick & Place
Pad
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
(7,11)
.280
02
–L
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions or
-05 & -07 lead
style)
01
–C*
(0,80)
.0315
(0,20)
.008
= Electro-Polished
Selective
50µ" (1,27 µm) min
Au over 150µ"
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm) Ni
on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
QTE
LEAD
STYLE
HEIGHT
WITH
QSE*
(5,00)
.197
(8,00)
.315
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
(5,97)
.235
–RT1
A
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,26)
.718
(24,24)
.954
–01
–02
–03
–04
–05
A
(3,30)
.130
(0,76)
.030
(1,57)
.062
(1,57)
.062
DIA
–RT1
= Retention
Option
(-01 Lead
Style only)
(N/A on 56 &
80 positions
or –L (latch)
option)
–L
= Latching
Option
(N/A on 42,
56, 60 & 80
positions or
–RT1 option)
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(0,89)
.035 DIA
(0,64)
.025
––L
–07
*Processing conditions
will affect mated height.
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