F-217
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0.80 mm) .0315"
QTE SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
Integral metal plane
for power or ground
Standard stack heights
from 5 mm to 25 mm
HIGH-SPEED CHANNEL PERFORMANCE
QTE-DP/QSE-DP @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
28
G b p s
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
(40 total pins per bank = –D)
–020, –040, –060
–014, –028, –042
(14 pairs per bank = –D–DP)
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
= Single-Ended
–D
FILE NO. E111594
FILE NO: 090871_0_000
–L
= Differential Pair
(–01 only)
–D–DP
= (7.00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–K
PROTOCOLS
• 100 GbE
• XAUI
• PCI Express
®
• SATA
• MGT (Rocket I/O)
• InfiniBand
™
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
–D = (No. of Positions per Row/20)
x (20.00) .7875
(20.00) .7875
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
–TR
01
(5.97)
.235
02
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
• 56 (-DP), 80, 100
positions per row
• Retention Option
Contact Samtec.
(0.80)
.0315
(0.20)
.008
A
= Electro-Polished
Selective
(7.11)
50 µ" (1.27 µm) min
.280
Au over 150µ"
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1.27 µm) min Ni on
all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
= Latching
Option
(N/A on –042 &
–060 positions)
–L
QTE
LEAD
STYLE
A
(4.27) .168
(7.26) .286
HEIGHT
WITH QSE*
(5.00) .197
(8.00) .315
(0.76)
.030
(0.89)
.035 DIA
(0.64)
.025
–L
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
–01
–02
–03
–04
–05
–07
–09
(10.27) .404 (11.00) .433
(15.25) .600 (16.00) .630
(18.26) .718 (19.00) .748
(24.24) .954 (25.00) .984
(13.26) .522 (14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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