ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64
ATM/SONET/SDH辅助电路, PQFP64
参数名称 | 属性值 |
功能数量 | 1 |
端子数量 | 64 |
最大工作温度 | 85 Cel |
最小工作温度 | -40 Cel |
额定供电电压 | 3.3 V |
加工封装描述 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 |
无铅 | Yes |
欧盟RoHS规范 | Yes |
状态 | ACTIVE |
包装形状 | SQUARE |
包装尺寸 | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
表面贴装 | Yes |
端子形式 | GULL WING |
端子间距 | 0.5000 mm |
端子涂层 | MATTE TIN |
端子位置 | QUAD |
包装材料 | PLASTIC/EPOXY |
温度等级 | INDUSTRIAL |
同步数字系列应用 | SDH Application |
sonnet应用 | SONET Application |
通信类型 | SUPPORT CIRCUIT |
MT9046 | ZL30406 | ZL30406QGC | ZL30406QGG1 | ZL30406_06 | ZL30407 | MT90401 | |
---|---|---|---|---|---|---|---|
描述 | ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 | ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 | ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 | ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 | ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 | ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 | ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
表面贴装 | Yes | Yes | YES | YES | Yes | Yes | Yes |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
最大工作温度 | 85 Cel | 85 Cel | - | - | 85 Cel | 85 Cel | 85 Cel |
最小工作温度 | -40 Cel | -40 Cel | - | - | -40 Cel | -40 Cel | -40 Cel |
额定供电电压 | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V |
加工封装描述 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | - | - | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 |
无铅 | Yes | Yes | - | - | Yes | Yes | Yes |
欧盟RoHS规范 | Yes | Yes | - | - | Yes | Yes | Yes |
状态 | ACTIVE | ACTIVE | - | - | ACTIVE | ACTIVE | ACTIVE |
包装形状 | SQUARE | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
包装尺寸 | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | - | - | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
端子间距 | 0.5000 mm | 0.5000 mm | - | - | 0.5000 mm | 0.5000 mm | 0.5000 mm |
端子涂层 | MATTE TIN | MATTE TIN | - | - | MATTE TIN | MATTE TIN | MATTE TIN |
包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
同步数字系列应用 | SDH Application | SDH Applicati | - | - | SDH Applicati | SDH Applicati | SDH Application |
sonnet应用 | SONET Application | SONET Applicati | - | - | SONET Applicati | SONET Applicati | SONET Application |
通信类型 | SUPPORT CIRCUIT | SUPPORT CIRCUIT | - | - | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT |
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