电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

MT9046

产品描述ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64
产品类别热门应用    无线/射频/通信   
文件大小237KB,共21页
制造商Zarlink Semiconductor (Microsemi)
官网地址http://www.zarlink.com/
下载文档 详细参数 选型对比 全文预览

MT9046概述

ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64

ATM/SONET/SDH辅助电路, PQFP64

MT9046规格参数

参数名称属性值
功能数量1
端子数量64
最大工作温度85 Cel
最小工作温度-40 Cel
额定供电电压3.3 V
加工封装描述10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64
无铅Yes
欧盟RoHS规范Yes
状态ACTIVE
包装形状SQUARE
包装尺寸FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
表面贴装Yes
端子形式GULL WING
端子间距0.5000 mm
端子涂层MATTE TIN
端子位置QUAD
包装材料PLASTIC/EPOXY
温度等级INDUSTRIAL
同步数字系列应用SDH Application
sonnet应用SONET Application
通信类型SUPPORT CIRCUIT

MT9046相似产品对比

MT9046 ZL30406 ZL30406QGC ZL30406QGG1 ZL30406_06 ZL30407 MT90401
描述 ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64 ATM/SONET/SDH SUPPORT CIRCUIT, PQFP64
功能数量 1 1 1 1 1 1 1
端子数量 64 64 64 64 64 64 64
表面贴装 Yes Yes YES YES Yes Yes Yes
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
最大工作温度 85 Cel 85 Cel - - 85 Cel 85 Cel 85 Cel
最小工作温度 -40 Cel -40 Cel - - -40 Cel -40 Cel -40 Cel
额定供电电压 3.3 V 3.3 V - - 3.3 V 3.3 V 3.3 V
加工封装描述 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 - - 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MS-026ACD, TQFP-64
无铅 Yes Yes - - Yes Yes Yes
欧盟RoHS规范 Yes Yes - - Yes Yes Yes
状态 ACTIVE ACTIVE - - ACTIVE ACTIVE ACTIVE
包装形状 SQUARE SQUARE - - SQUARE SQUARE SQUARE
包装尺寸 FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - - FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
端子间距 0.5000 mm 0.5000 mm - - 0.5000 mm 0.5000 mm 0.5000 mm
端子涂层 MATTE TIN MATTE TIN - - MATTE TIN MATTE TIN MATTE TIN
包装材料 PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
同步数字系列应用 SDH Application SDH Applicati - - SDH Applicati SDH Applicati SDH Application
sonnet应用 SONET Application SONET Applicati - - SONET Applicati SONET Applicati SONET Application
通信类型 SUPPORT CIRCUIT SUPPORT CIRCUIT - - SUPPORT CIRCUIT SUPPORT CIRCUIT SUPPORT CIRCUIT

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 4  214  510  647  689 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved