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ULC0402FC15C-T75-1

产品描述Trans Voltage Suppressor Diode, 200W, 15V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4
产品类别分立半导体    二极管   
文件大小567KB,共8页
制造商ProTek Devices
官网地址http://www.protekdevices.com/
标准
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ULC0402FC15C-T75-1概述

Trans Voltage Suppressor Diode, 200W, 15V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4

ULC0402FC15C-T75-1规格参数

参数名称属性值
是否Rohs认证符合
厂商名称ProTek Devices
零件包装代码FLIP-CHIP
包装说明R-XBCC-N4
针数4
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
其他特性LOW CAPACITANCE
最小击穿电压16.7 V
击穿电压标称值16.7 V
最大钳位电压34.5 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码R-XBCC-N4
JESD-609代码e1
湿度敏感等级1
最大非重复峰值反向功率耗散200 W
元件数量1
端子数量4
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式CHIP CARRIER
峰值回流温度(摄氏度)245
极性BIDIRECTIONAL
认证状态Not Qualified
最大重复峰值反向电压15 V
表面贴装YES
技术AVALANCHE
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式NO LEAD
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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05152
Only One Name Means ProTek’Tion™
ULC0402FC3.3C - ULC0402FC36C
200W LOW CAPACITANCE UNbUmPEd FLIP ChIP Tvs ARRAy
dEsCRIPTION
The ULC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic
Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4
requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In
addition, the ULC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their
low inductance virtually eliminates overshoot voltage due to package inductance.
FEATUREs
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional and Monolithic Structure
Low Clamping Voltage
Low Capacitance
Protection for 1 Line
RoHS Compliant
REACH Compliant
APPLICATIONs
• SMART Phones
• Portable Electronics
• SMART Cards
mEChANICAL ChARACTERIsTICs
Standard EIA Chip Size: 0402
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Flammability Rating UL 94V-0
8mm Plastic Tape per EIA Standard 481
PIN CONFIGURATION
05152.R11 10/12
Page 1
www.protekdevices.com

ULC0402FC15C-T75-1相似产品对比

ULC0402FC15C-T75-1 ULC0402FC24C-T75-1 ULC0402FC08C-T75-1 ULC0402FC12C-T75-1 ULC0402FC05C-T75-1 ULC0402FC3.3C-T75-1 ULC0402FC36C-T75-1
描述 Trans Voltage Suppressor Diode, 200W, 15V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4 Trans Voltage Suppressor Diode, 200W, 24V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4 Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4 Trans Voltage Suppressor Diode, 200W, 12V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4 Trans Voltage Suppressor Diode, 200W, 5.9V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4 Trans Voltage Suppressor Diode, 200W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4 Trans Voltage Suppressor Diode, 200W, 36V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-4
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
零件包装代码 FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP
包装说明 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4
针数 4 4 4 4 4 4 4
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE LOW CAPACITANCE
最小击穿电压 16.7 V 26.7 V 8.5 V 13.3 V 6 V 4 V 40 V
最大钳位电压 34.5 V 50.6 V 18 V 26.9 V 13 V 12.5 V 80 V
配置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
二极管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON
二极管类型 TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4 R-XBCC-N4
JESD-609代码 e1 e1 e1 e1 e1 e1 e1
最大非重复峰值反向功率耗散 200 W 200 W 200 W 200 W 200 W 200 W 200 W
元件数量 1 1 1 1 1 1 1
端子数量 4 4 4 4 4 4 4
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
峰值回流温度(摄氏度) 245 245 245 245 245 245 245
极性 BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大重复峰值反向电压 15 V 24 V 8 V 12 V 5.9 V 3.3 V 36 V
表面贴装 YES YES YES YES YES YES YES
技术 AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
厂商名称 ProTek Devices - ProTek Devices ProTek Devices ProTek Devices ProTek Devices ProTek Devices
击穿电压标称值 16.7 V 26.7 V 8.5 V 13.3 V 6 V 4 V -
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