Bus Exchanger, HC/UH Series, 1-Func, 4-Bit, True Output, CMOS, PDSO20, FP-20DA
| 参数名称 | 属性值 |
| 厂商名称 | Hitachi (Renesas ) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G20 |
| 长度 | 12.6 mm |
| 逻辑集成电路类型 | BUS EXCHANGER |
| 位数 | 4 |
| 功能数量 | 1 |
| 端口数量 | 3 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 传播延迟(tpd) | 250 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 4.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 5.5 mm |
| Base Number Matches | 1 |

| HD74HC442FP | HD74HC443RP | HD74HC444P | HD74HC442P | HD74HC442RP | |
|---|---|---|---|---|---|
| 描述 | Bus Exchanger, HC/UH Series, 1-Func, 4-Bit, True Output, CMOS, PDSO20, FP-20DA | Bus Exchanger, HC/UH Series, 1-Func, 4-Bit, Inverted Output, CMOS, PDSO20, FP-20DB | Bus Exchanger, HC/UH Series, 1-Func, 4-Bit, True Output, CMOS, PDIP20, DP-20N | Bus Exchanger, HC/UH Series, 1-Func, 4-Bit, True Output, CMOS, PDIP20, DP-20N | Bus Exchanger, HC/UH Series, 1-Func, 4-Bit, True Output, CMOS, PDSO20, FP-20DB |
| 厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
| 零件包装代码 | SOIC | SOIC | DIP | DIP | SOIC |
| 包装说明 | SOP, | SOP, | DIP, | DIP, | SOP, |
| 针数 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
| 长度 | 12.6 mm | 12.8 mm | 24.5 mm | 24.5 mm | 12.8 mm |
| 逻辑集成电路类型 | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER |
| 位数 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | INVERTED | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 传播延迟(tpd) | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.2 mm | 2.65 mm | 5.08 mm | 5.08 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 5.5 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm |
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