RF/Microwave Frequency Multiplier
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | LSC/CSI |
| 包装说明 | DIP16,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-609代码 | e0 |
| 安装特点 | THROUGH HOLE MOUNT |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装等效代码 | DIP16,.3 |
| 电源 | 5 V |
| 最大压摆率 | 30 mA |
| 表面贴装 | NO |
| 端子面层 | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 |
| PL1TCA | PL1GLA | PL1TLA | PL3GLA | PL3TLA | PL4GEA | PL4TLA | PL2GLA | PL2TLA | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier | RF/Microwave Frequency Multiplier |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI |
| 包装说明 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 安装特点 | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装等效代码 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 | GWDIP16,.3 | DIP16,.3 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大压摆率 | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA |
| 表面贴装 | NO | YES | NO | YES | NO | YES | NO | YES | NO |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Is Samacsys | N | N | N | N | N | N | N | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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