5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Macronix |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP42,.6 |
| 针数 | 42 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 120 ns |
| 其他特性 | CAN ALSO BE CONFIGURED AS 2M X 16 |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PDIP-T42 |
| 长度 | 51.94 mm |
| 内存密度 | 33554432 bi |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 42 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP42,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.9 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| MX23C3210PC-12G | MX23C3210TI-12 | MX23C3210TI-10 | MX23C3210TC-12G | MX23C3210TC-10G | MX23C3210PC-10G | MX23C3210MC-12G | MX23C3210MC-10G | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | 5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| 零件包装代码 | DIP | TSOP1 | TSOP1 | TSOP1 | TSOP1 | DIP | SOIC | SOIC |
| 包装说明 | DIP, DIP42,.6 | TSSOP, TSSOP48,.8,20 | TSSOP, TSSOP48,.8,20 | TSSOP, TSSOP48,.8,20 | TSSOP, TSSOP48,.8,20 | DIP, DIP42,.6 | SOP, SOP44,.63 | SOP, SOP44,.63 |
| 针数 | 42 | 48 | 48 | 48 | 48 | 42 | 44 | 44 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 120 ns | 120 ns | 100 ns | 120 ns | 100 ns | 100 ns | 120 ns | 100 ns |
| 其他特性 | CAN ALSO BE CONFIGURED AS 2M X 16 | CAN ALSO BE CONFIGURED AS 2M X 16 | CAN ALSO BE CONFIGURED AS 2M X 16 | CAN ALSO BE CONFIGURED AS 2M X 16 | CAN ALSO BE CONFIGURED AS 2M X 16 | CAN ALSO BE CONFIGURED AS 2M X 16 | CAN ALSO BE CONFIGURED AS 2M X 16 | CAN ALSO BE CONFIGURED AS 2M X 16 |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDIP-T42 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G44 |
| 长度 | 51.94 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 51.94 mm | 28.5 mm | 28.5 mm |
| 内存密度 | 33554432 bi | 33554432 bi | 33554432 bi | 33554432 bi | 33554432 bi | 33554432 bi | 33554432 bi | 33554432 bi |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 42 | 48 | 48 | 48 | 48 | 42 | 44 | 44 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSSOP | TSSOP | TSSOP | TSSOP | DIP | SOP | SOP |
| 封装等效代码 | DIP42,.6 | TSSOP48,.8,20 | TSSOP48,.8,20 | TSSOP48,.8,20 | TSSOP48,.8,20 | DIP42,.6 | SOP44,.63 | SOP44,.63 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.9 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 4.9 mm | 3 mm | 3 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 | 40 |
| 宽度 | 15.24 mm | 12 mm | 12 mm | 12 mm | 12 mm | 15.24 mm | 12.6 mm | 12.6 mm |
| JESD-609代码 | - | e0 | e0 | e6 | e6 | - | e3 | e3 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Bismuth (Sn/Bi) | Tin/Bismuth (Sn/Bi) | - | Matte Tin (Sn) | Matte Tin (Sn) |
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